OSAT ASE Technology reportedly is seeking to secure chip-on-wafer (CoW) packaging certification from Nvidia for its Kaohsiung plant in southern Taiwan, according to industry source...
Japan's advanced electric battery technology company noco-noco Inc. is set to start trading on the Nasdaq on Monday, helping move its sustainability efforts one step closer to mainstream...
Tripod Technology has started shipping universal baseband boards (UBB) for AI servers since the second half of this year, with shipments expected to increase in 2024, according to...
Chinese AI tech developer iFlytek has disclosed that the company is partnering with Huawei for AI solutions utilizing Huawei's in-house developed GPU technology.
Montage Technology, a Chinese manufacturer of memory interface devices and PCIe retimer chips, is collaborating with H3C, a Tsinghua Unigroup-affiliated company, to promote Compute...
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, expects its revenue to hit bottom for 2023 in the third or early fourth quarter...
OSATs ASE Technology and King Yuan Electronics (KYEC), both of which reportedly are in the supply chain for Nvidia's AI chips, are likely to experience revenue declines in 2023 despite...
IC distributor GMI Technology has expressed caution about its prospects for the second half of this year, citing uncertainty in demand from new telecommunication tenders and bids.
Kenmec Mechanical Engineering has successfully developed two-phase immersion cooling technology, targeting the AI server cooling market. This two-phase liquid cooling system has been...
Artificial intelligence (AI) will bring substantial growth to the semiconductor industry, according to Mark Wang, chairman for IC test interface specialist WinWay Technology.
Speculation has emerged that Intel's expanding fab site in Oregon will serve as a foundry for MediaTek using the Intel 18A technology, with production beginning as early as 2025.
Chinese OSATs with support from government subsidies have reduced their prices further in an effort to secure more orders, whereas first-tier semiconductor backend services providers...
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
