The monthly output of 3nm chips at TSMC will climb to 125,000 wafers in the second half of this year, up from 100,000 units currently, according to industry sources. The output ramp-up...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) stayed unprofitable in the first half of 2024 but anticipates a gradual revenue rebound in the third quarter.
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
Hoping to get the 140,000 talents needed for industrial development by 2030, Taiwan's Chip-based Industrial Innovation (CbI) Program is actively attracting international students...
With trade barriers from Europe and the US against Chinese solar imports, the Middle East, which is currently moving toward clean energy transformation and enjoys good trade relationships...
Global 5G user numbers continue to grow strongly, with population coverage gradually expanding and simultaneously boosting 5G Stand-alone (SA) deployment. Ericsson predicts that nearly...
With the current boom of generative AI, British AI chip unicorn Graphcore should've enjoyed the dividends from AI. Instead, it found itself struggling.
South Korea's two major display manufacturers are optimistic about evolving market demands and are targeting the on-device AI OLED market. The next-generation "tandem OLED" technology...
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
Huawei Technologies has completed the construction of its largest research and development (R&D) center, the Huawei Lianqiu Lake R&D Center, in Shanghai's Qingpu District.
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
Taiwan has established an R&D initiative akin to the US Department of Defense's Defense Innovation Unit (DIU). This initiative serves as the matchmaker between the military procurement...
