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NEWS TAGGED TESSERA
Wednesday 6 June 2018
Xperi continues to bring forth innovative technologies, focusing efforts on three major areas including smart home and other markets
DTS, HD Radio and FotoNation, each mastering different technologies, merged together in 2017 along with Invensas and Tessera to form Xperi Corporation to deliver innovative total...
Tuesday 3 May 2016
Invensas signs BVA technology license and development agreement with ASE
Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...
Thursday 6 November 2014
ASE payment to settle patent litigation with Tessera reduced
Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that its payment to settle patent disputes with Tessera have been...
Thursday 27 February 2014
PTI to pay Tessera US$196 million in patent lawsuit settlement
Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with...
Wednesday 26 February 2014
ASE to pay US$30 million to Tessera to settle patent case
Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to...
Tuesday 29 January 2013
STATS ChipPAC enters into license and settlement agreement with Tessera
STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...
Thursday 24 November 2011
Samsung, Hynix renew license deals with Tessera through 2017
Tessera Technologies on November 23 announced that Hynix Semiconductor has exercised the renewal option in its 2005 license agreement to extend the term to May 2017.
Tuesday 9 March 2010
PTI seeking clarity on ITC ruling in Tessera DRAM case
Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...
Thursday 31 December 2009
IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
Wednesday 30 December 2009
Tessera loses ITC chip-patent case against DRAM makers and sellers
Nanya Technology on December 30 announced the US International Trade Commission (ITC) has affirmed the company and other DRAM makers that no violation was found in the Investigation...
Tuesday 6 October 2009
New Tessera FotoNation technology enables reliable, robust face recognition for mobile devices
SAN JOSE, Calif., Oct 04, 2009 - Tessera Technologies, Inc. (Nasdaq:TSRA) has announced its FotoNation FaceRecognition technology, which performs automatic identification of specific...
Wednesday 18 March 2009
Tessera terminates patent lawsuit against packaging and testing firms
Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...
Thursday 12 February 2009
Tessera licenses micro-PILR technology to Taiwan-based Kinsus
Tessera Technologies has announced that Taiwan IC substrate maker Kinsus Interconnect Technology has licensed Tessera's micro-PILR interconnect platform, which reduces semiconductor...
Thursday 2 October 2008
Tessera licenses TSV technology to Korea-based packaging house
Tessera Technologies has announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed its full range of Shellcase image sensor packaging technologies, including its...
Tuesday 23 September 2008
Tessera single-element VGA lens to enter volume production in 1Q09
Tessera Technologies a provider of transformational technologies that enable innovation in next-generation electronics, announced its new Product Launch Services, which will provide...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research