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Monday 3 March 2025
Qualcomm Snapdragon X2 specs leak: up to 18 Oryon V3 cores expected
Qualcomm's next-generation Snapdragon X2 processor, codenamed "Project Glymur," is reportedly in development for Windows PCs. The chip is expected to feature up to 18 third-generation...
Monday 3 March 2025
IBM shuts down China research operations, impacting 1,800 R&D jobs
IBM China Investment Company Limited (IBMV) and its subsidiaries shut down on March 1, impacting over 1,800 R&D and testing staff in Beijing, Shanghai, Dalian, and other sites...
Friday 28 February 2025
CCP Contact Probes targets AI chip supply chain with advanced packaging solutions
Benefiting from the booming demand for testing related to artificial intelligence (AI), CCP Contact Probes, a probe development and manufacturing company, has optimized its product...
Thursday 27 February 2025
SK Hynix reportedly hits 70% yield in HBM4 testing
SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its sixth-generation high-bandwidth memory (HBM4) to 70%. This achievement...
Thursday 27 February 2025
Apptronik partners with Jabil to scale production of Apollo humanoid robots for widespread industrial use
Apptronik and Jabil have forged a strategic partnership to manufacture and deploy Apollo humanoid robots in real-world factory environments. This collaboration will allow Jabil to...
Wednesday 26 February 2025
ChipMOS forecasts modest 1Q25 revenue decline; aims to raise utilization
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines, primarily...
Tuesday 25 February 2025
Chroma ATE hits record 2024 profits, targets 2025 growth in semiconductors, AR glasses, and AI servers
Chroma ATE, Taiwan's leading supplier of automated testing and measurement equipment, achieved a milestone in 2024, posting its highest post-tax net profits in 40 years. Looking ahead...
Tuesday 25 February 2025
AI GPU orders max out TSMC’s CoWoS capacity; IC testing firms booked through 2026
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...