Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
Founded in 2018, California-based company Ventana Micro Systems has taken steps to bring the open-source instruction set architecture RISC-V into the data center market. The effort...
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
As US sanctions continue to intensify, China's semiconductor industry has been looking for ways to bypass the curbs. Chiplet, a modular approach of chip design that integrates multiple...
