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NEWS TAGGED WAFER
Monday 29 July 2024
EU subsidies for fab construction progressing slowly; both TSMC and Intel yet to be approved
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
Thursday 25 July 2024
Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Thursday 25 July 2024
TSMC to break ground for German fab at year-end 2024, sources say
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Thursday 25 July 2024
TSMC fab in Germany faces challenges for profitability
TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.
Wednesday 24 July 2024
Intel Foundry faces hurdles in European expansion and performance struggles
Intel has confirmed that part of its European investment project has been shelved due to economic reasons, highlighting the chipmaker's challenges in its foundry business, which relies...
Tuesday 23 July 2024
TSMC stands firm amid high costs and Trump's criticism, global chip mass production on target
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Tuesday 23 July 2024
TSMC outpaces Samsung in HPC revenue growth for 2Q24
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Monday 22 July 2024
Samsung increases number of MPW service offerings for fourth consecutive year
Samsung Electronics is set to increase its Multi-Project Wafer (MPW) service offerings for the fourth consecutive year, with plans to raise the number to 35 in 2025. This move not...
Friday 19 July 2024
Samsung Exynos 2500 marks pivotal comeback amid looming competition
Samsung Electronics is making significant strides with its next-generation mobile application processor, the Exynos 2500. Despite initial reports of low yield rates, recent industry...
Friday 19 July 2024
Samsung halts foundry line construction at P4 amid customer challenges
Samsung Electronics is reportedly adjusting its investment pace and postponing the construction of the wafer foundry line at its Pyeongtaek Plant 4 (P4) due to difficulties in securing...
Friday 19 July 2024
Singapore gears up for semiconductor boom with new land and perks
Singapore is preparing additional land and boosting amenities to draw more semiconductor wafer fabs.
Thursday 18 July 2024
TSMC expects around 10% revenue growth in 3Q24
TSMC announced that revenue and margins exceeded guidance in the second quarter of 2024, and it expects revenue for the third quarter to increase 9.5% sequentially at the midpoint.
Thursday 18 July 2024
Chinese PV companies flock to Middle East with new projects
Chinese firms in the solar power industry are accelerating their expansions into the Middle East, establishing an ecosystem covering both upstream and downstream sectors.
Wednesday 17 July 2024
GlobalWafers receives US$400 million of CHIPS Act funding
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
Friday 12 July 2024
TSMC's Kumamoto fab holds advantages through key technology like immersion lithography and multiple patterning
TSMC's Japanese subsidiary, JASM, is set to begin mass production at its first wafer fab in Kumamoto in 2024.