Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
China-based pure-play foundry Semiconductor Manufacturing International Corporation (SMIC) reported a decline in profit despite growing revenue by more than 20% amid intense competition...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
Silicon wafer company GlobalWafers has revised its revenue growth projection for 2024 to a decline in the high single digits. The revision was downgraded for the second time this...
Despite a strong overall performance in the second quarter of 2024, Samsung Electronics continues to grapple with losses in its wafer foundry business. Most analyses indicate that...
Worldwide silicon wafer shipments increased 7.1% quarter-on-quarter to 3.035 billion square inches in the second quarter of 2024, but saw an 8.9% decline from the 3.33 billion square...
Epitaxial wafer manufacturer LandMark Optoelectronics expects its product mix improvement to drive revenue and profit growth in the third quarter, as US silicon photonics customers...
Pure-play foundry United Microelectronics (UMC) expects to post a mid-single-digit sequential increase in wafer shipments with about flat growth in ASPs in the third quarter of 2024,...
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Memory prices are expected to remain stable or go up in the third quarter of 2024 for different market segments, but consumer demand will continue to be disappointing, according to...
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Intel has confirmed that part of its European investment project has been shelved due to economic reasons, highlighting the chipmaker's challenges in its foundry business, which relies...
