Increasing silicon carbide (SiC) substrate supply from China at lower prices is expected to fuel Taiwan-based foundry houses' diversification into compound semiconductors.
India is hosting SEMICON India 2024 from September 11-13. Tata Electronics has announced that its wafer fab project in Gujarat—India's first commercial fab in three decades—has...
Following the announcement of a technology transfer agreement with Tata Electronics—set to establish India's first commercial wafer fab in three decades—Powerchip Semiconductor...
Tokyo Electron, a leading semiconductor equipment provider from Japan, will supply chipmaking tools to Tata Electronics, which is constructing India's first wafer fab. Meanwhile,...
China-based Guangzhou Summit Crystal Semiconductor (GZSC) is seeking business opportunities in Taiwan, eyeing the potential of Taiwan's 8-inch SiC wafer fabrication.
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
Intel's wafer manufacturing is facing significant challenges. Recent reports suggest that Broadcom estimates the Intel 18A process has not yet achieved mass production capability,...
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
As Semicon India 2024 approaches, Tower Semiconductor and the Adani Group have announced a partnership to establish a wafer fab in Maharashtra, India. This strategic collaboration...
PCIM Asia 2024 recently kicked off in Shenzhen, China, gathering a diverse array of international and Chinese firms focused on power semiconductors. The event prominently featured...
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
World leaders in wafer and microelectronic subsystem assembly have chosen Québec for its strong government support and industry knowledge through the whole value chain particularly...
