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NEWS TAGGED WIREBOND
Wednesday 8 July 2009
SPIL 2Q09 sales up more than 50%
Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...
Tuesday 2 June 2009
ASE, SPIL optimistic about 3Q09
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
Tuesday 29 July 2008
NPC to relocate wirebond capacity to China
Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research