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NEWS TAGGED YUKON
Monday 19 October 2009
MSI launches AMD-based Wind12 U210 notebook
Micro-Star International (MSI) has introduced the Wind12 U210 notebook, featuring a 12.1-inch LED backlit display and AMD's ultra-thin power saving platform.
Thursday 15 October 2009
AMD Congo platform notebooks to be launched in early November 2009 timeframe
AMD partners plan to launch Congo platform ultra-thin notebooks at the end of October or beginning of November, after postponing the launch from the end of July as originally planned...
Friday 21 August 2009
MSI likely to launch AMD Yukon-based notebooks in October 2009
Micro-Star International (MSI) is expected to launch AMD Yukon-based ultra-thin notebooks in October 2009 at the earliest, according to industry sources.
Tuesday 16 June 2009
BenQ launches AMD-based ultra-thin notebook
BenQ has launched its latest ultra-thin notebook, the Joybook Lite T131, featuring a 13.3-inch UltraVivid screen, AMD's Yukon mobile platform, integrated microphone and webcam, and...
Monday 18 May 2009
AMD to showcase new notebook platform at Computex 2009, says paper
AMD plans to showcase its new notebook platform (Tigris) at Computex 2009, according to a Chinese-language Commercial Times report. The new platform consists a 45nm dual-core...
Thursday 2 April 2009
Taiwan market: HP launches Yukon-based Pavilion dv2 ultra-thin notebook
Hewlett-Packard (HP) has launched its 12.1-inch Pavilion dv2 ultra-thin notebook in the Taiwan market. The notebook adopts AMD's Yukon platform and is manufactured by Flextronics.
Friday 20 February 2009
AMD pushes Yukon platform into all-in-one PC market
AMD has began to push its Yukon platform into the low-cost all-in-one PC market giving vendors the opportunity to differentiate themselves in the (currently Intel Atom dominated)...
Monday 19 January 2009
Intel to target ultra-portable notebook market with CULV platform
Intel plans to push a new consumer ultra-low voltage (CULV) platform into the market for ultra-portable notebooks priced between US$699-899 in the second quarter of 2009. The move...
Friday 16 January 2009
AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
Friday 5 December 2008
AMD global notebook market share might drop below 10% next year due to netbooks
As Intel Atom processor shipments continue to increase, while AMD has yet to come up with an official netbook platform of its own, AMD's share of the global notebook market might...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research