HannStar Display is preparing to cut output at its only fab roughly in half, alongside a workforce reduction that industry sources put at as much as 70% — being carried out through...

Starlink's enormous low-Earth-orbit (LEO) footprint has long cast a shadow over the broader aerospace industry, turning satellite broadband into a race defined as much by constellation...

Apple’s move into foldable smartphones is creating fresh business for Japanese component makers with expertise in thin, lightweight and compact designs. According to Nikkei...

Taiwan's power and energy companies are looking to grow their presence in Europe. To support that push, the Chinese International Economic Cooperation Association (CIECA) organized...

Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.

Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...

Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...

German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...

At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...

Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...

Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...

China's energy storage industry has expanded at breakneck speed since the launch of the 14th Five-Year Plan, growing 50-fold in just five years. The government is now applying the...

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...

Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based...