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Tuesday 3 December 2024
Denso, Fuji Electric secure METI subsidy for SiC chip mass production
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production...
Monday 2 December 2024
Notebook shipment update, October 2024
Notebook deployment at channels in Europe and North America for year-end holidays decelerates, leading to a 26% on-month shipment deceleration for top-5 notebook brands together in...
Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Monday 2 December 2024
United, we thrive: Mitsubishi Electric aims to restructure Japan's power semiconductor sector
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector,...
Monday 2 December 2024
Murata cements MLCC market supremacy with focus on AI, smartphones, and wearables
Murata Manufacturing Co. has unveiled a new mid-term business plan focused on boosting market share for its flagship product, Multi-layer Ceramic Capacitors (MLCCs), in response to...
Monday 2 December 2024
DeepX AI chip achieves up to 90% yield with Samsung's 5nm process
South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics' foundry division, the company has achieved...
Monday 2 December 2024
Samsung slashes photoresist usage in 3D NAND production, impacts supplier
Samsung Electronics has reportedly reduced its use of thick photoresist (PR) in the photolithography process for its latest 3D NAND flash, achieving significant cost savings. This...
Monday 2 December 2024
Weekly news roundup: SMIC leads China's semiconductor rise as memory makers gain ground
Semiconductor Week in Review (Nov 24 - 30) :
Monday 2 December 2024
Taiwan weighs overseas science parks to tackle talent and resource challenges
Amid mounting pressures on talent and resources, Taiwan is looking to widen its horizons abroad, exploring the possibility of establishing science parks beyond its borders as part...
Monday 2 December 2024
US drone maker Skydio faces battery crisis amid China sanctions
The largest US drone maker struggles with supply chain disruption after selling drones to Taiwan's fire departments, with current inventory projected to last until spring 2025.
Monday 2 December 2024
China's domestic chip equipment push threatens South Korean manufacturers
Due to US sanctions, China has been unable to acquire advanced semiconductor manufacturing equipment and is now shifting its focus toward mature processes. Although this shift has...
Monday 2 December 2024
Acer Cyber Security harnesses AI to counter evolving threats
The growing adoption of AI across industries and intensifying geopolitical tensions have led to escalating cybersecurity threats, fueling demand for robust solutions and digital forensic...
Monday 2 December 2024
Kioxia's IPO set to reshape memory industry
Japanese NAND manufacturer Kioxia has secured approval for its initial public offering (IPO) on the Tokyo Stock Exchange, scheduled for December 18. South Korean SK Hynix may acquire...
Monday 2 December 2024
Taiwan expands science parks to strengthen industrial clusters
Taiwan's Minister of Economic Affairs J.W. Kuo announced plans for TSMC to construct a new domestic plant annually. The ministry is actively preparing water and electricity infrastructure...
Monday 2 December 2024
Trump's America First raises stakes for TSMC's advanced processes
President-elect Donald Trump, who will take office on January 20, 2025, has voiced strong criticism of the Biden administration's CHIPS Act subsidies. His America First policy is...