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Monday 7 June 2021
Realme aims to ship 100 million 5G phones in 3 years
China-based handset brand Realme reportedly aims to sell 100 million 5G smartphones in the next three years, according to industry sources.
Friday 4 June 2021
Qualcomm deepening deployments in 5G PC processors
Qualcomm is stepping up its deployments in 5G PC processors seeking to tap demand from the segments of both high-end commercial notebooks and lower-end education and consumer notebooks,...
Friday 4 June 2021
Texas Instruments remains top analog IC supplier
With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Thursday 3 June 2021
Supermicro gearing up for capacity expansion in Taiwan
US-based server maker Supermicro expects to complete constructing a new plant at its manufacturing site in Taoyuan, northern Taiwan, in July 2021. Once the facility comes online,...
Thursday 3 June 2021
ACX to commercialize new capacity for LTCC components in 3Q21
Taiwan-based ACX, specializing in LTCC (low temperature co-fired ceramic) components for RF front-end modules, is set to complete a 40% capacity expansion in the third quarter, adding...
Wednesday 2 June 2021
EMC component supplier Wendell enjoys clear order visibility through 3Q21
Taiwan-based Wendell Industrial, a supplier of EMC (electromagnetic compatibility) and other circuit protection components, is upbeat about its operations in the third quarter of...
Wednesday 2 June 2021
Korea firms to increase capex for 5G infrastructure in 2021-2022, says Digtimes Research
The amounts of capex set by Korea's top-three telecom operators, SK Telecom (SKT), Korea Telecom (KT) and LG U+, in 2021 and 2022, respectively, will be higher than those seen in...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
Over 50% of next-gen iPhones to support 5G mmWave technology
More than 50% of Apple's next-generation iPhone devices slated for launch in the latter half of 2021 reportedly will support 5G mmWave technology, according to industry sources.
Monday 31 May 2021
Intel announces new CPUs and 5G module at Computex 2021
Intel has announced two new additions to the lineup of 11th Gen Intel Core processors and introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution...
Friday 28 May 2021
Acer intros new Chromebook, notebook series for WFH users
Acer has introduced a new lineup of Chromebooks, gaming and ultra-thin notebooks targeted at users working and learning from home.
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
Friday 28 May 2021
Android camp slow in adopting mmWave
Chinese vendors have yet to release mmWave 5G models and corresponding infrastructure construction in China remains slow, according to industry sources.
Wednesday 26 May 2021
Global 200mm fab capacity to grow at record pace, says SEMI
Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...