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Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Monday 24 May 2021
Solidworks expects surging sales from cloud computing business in 2021
Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...
Monday 24 May 2021
CCL makers on track for capacity expansions
Taiwan's CCL makers Iteq and Elite Material (EMC) are gearing up to build additional capacity as demand from clients has outstripped their maximum capacity supply since the start...
Monday 24 May 2021
China well positioned to emerge as key player in IoT, says GlobalData
To counter the geopolitical challenge and reduce its dependence on the US, China is accelerating investment in next-generation enabling technologies. Against this backdrop, the country...
Friday 21 May 2021
5G growing rapidly despite component shortages, says Strategy Analytics
Radio component revenue reached an all-time high in 2020, according to Strategy Analytics, which expects revenue to grow through 2025.
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Friday 21 May 2021
New Qualcomm 5G SoC built using TSMC 6nm process
Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...
Friday 21 May 2021
China smartphone AP shipments – 1Q 2021
First-quarter 2021 smartphone AP shipments to China-based vendors amounted to 212 million units, maintaining a similar level to the prior quarter and soaring 56.9% from a year ago.
Thursday 20 May 2021
China 5G smartphone shipments to top 100 million units in Jan-May
A total of 91.27 million 5G smartphones were shipped to the China market in the first four months of 2021, according to data from the China Academy of Information and Communications...
Thursday 20 May 2021
Sintrones welcomes growth opportunities for electric vehicles with in-vehicle computer solutions
Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility,...
Thursday 20 May 2021
China smartphone market and industry – 1Q 2021
First-quarter 2021 smartphone shipments to the China market amounted to 94.6 million units. The volume represented a growth of 9% quarter-over-quarter and an upsurge of 99.6% year-over-year...
Wednesday 19 May 2021
Car PCB maker Dynamic sees order visibility extended to 3Q21
Automotive PCB specialist Dynamic Electronics has seen clear order visibility through the third quarter of 2021, and expects its gross margins in 2021 to be higher than the best performance...