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Wednesday 23 June 2021
FSP's power supply and micro-customization services help implement 5G smart manufacturing
With the rise of the 5G smart manufacturing trend, the volume of equipment in factories is expanding and processes are continuously being refined, which has led to an increasing demand...
Wednesday 23 June 2021
Globalfoundries breaks ground for new fab in Singapore
Globalfoundries on June 22 broke ground for a new 12-inch wafer fab at its Singapore campus, according to the pure-play foundry.
Tuesday 22 June 2021
BT substrate supply may fall short of demand in 2H21
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
Monday 21 June 2021
CCL demand for 5G base stations may gain momentum in Europe, US in 2022
CCL demand for 5G base station applications in the US and Europe are not expected to take off until 2022 at the earliest, according to industry sources.
Monday 21 June 2021
TSMC to start equipment move-in at Arizona fab as early as mid-2022
Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.
Monday 21 June 2021
5G smartphone shipments to outpace 4G ones in 2022, says Canalys
Worldwide shipments of 5G smartphones will reach 610 million units in 2021, accounting for around 43% of total smartphones to be shipped, according to Canalys. The proportion will...
Friday 18 June 2021
Winbond intros 1.8V 512Mb SPI NOR flash for 5G, server apps
Winbond Electronics has announced it is expanding its total solution of SPI NOR flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash that can support...
Thursday 17 June 2021
Ansys multiphysics solutions achieve certification for TSMC N3 and N4
Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...
Wednesday 16 June 2021
5G models to account for 80% of Taiwan handset sales in 2H21
Sales of 5G smartphones in the Taiwan market are likely to account for over 80% of total handset shipments in the second half of 2021 thanks to the new offerings of 5G models from...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Wednesday 16 June 2021
Taiwan IC design houses upbeat about shipments for 5G phones
Taiwan-based IC design houses are optimistic about their shipments for smartphone applications in the third quarter of 2021, thanks to the upcoming rollouts of new 5G-enabled models,...
Friday 11 June 2021
O-RAN market set to rise along with 5G private networks
The 5G private network architecture outlined in 3GPP Release 16 allows businesses to deploy private networks by themselves, which will not only bring changes to the previous model...
Friday 11 June 2021
GaAs IC firms gearing up for smartphone PA shipment pick-up
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are gearing up for a seasonal...
Friday 11 June 2021
Global smartphone AP market posts double-digit growth in 1Q21
The global smartphone applications processor (AP) market surged 21% on year to US$6.8 billion in the first quarter of 2021, according to Strategy Analytics.
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...