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Wednesday 27 January 2021
MediaTek, Swisscom, Ericsson and Oppo enable 5G CA and VoNR
MediaTek has announced it has reached a 5G carrier aggregation (CA) and voice over new radio (VoNR) milestone in collaboration with Swisscom, Ericsson and Oppo, advancing 5G networks...
Tuesday 26 January 2021
RFID specialist SAG to tap 5G opportunities
Taiwan-based RFID specialist Securitag Assembly Group (SAG) expects the commercialization of 5G networks will be instrumental in boosting sales of its products, including RFID labels...
Tuesday 26 January 2021
ABF substrate suppliers see clear order visibility stretch into 2H21
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Tuesday 26 January 2021
CCL makers ramping up shipments for 5G base stations in 1Q21
Taiwan CCL suppliers are expected to see shipments of high-frequency, high-end offerings for 5G base stations ramp up through at least the first-quarter of 2021, as clients are turning...
Monday 25 January 2021
Taiwan IC design houses slow new chip development due to foundry capacity shortage
Taiwan-based IC design houses, including MediaTek, continue to encounter tight capacity at their foundry partners and have to decelerate the development of their new chip products...
Monday 25 January 2021
BT substrate shipments for 5G handset SoCs may slow down in 2Q21
Taiwan's IC substrate suppliers will continue to enjoy robust shipments of BT-based FCCSP substrates for handset SoCs throughout first-quarter 2021, but may see off-season impacts...
Monday 25 January 2021
Intel not yet a major customer of TSMC
Despite speculation circulating recently that Intel is looking to outsource more chip production to TSMC, the CPU vendor does not seem to be ready to play a meaningful role in the...
Monday 25 January 2021
MediaTek to roll out upgraded 5G chips in 1H21
Judging from MediaTek's product roadmap, the chipmaker is expected to unveil the upgraded versions of its Dimensity 800 and 700 5G SoC lineups in second-quarter 2021, according to...
Monday 25 January 2021
India to see rapid growth for 5G smartphones
Though it remains uncertain when 5G commericial will start in India, 5G smartphone sales in the country will still see rapid growth in 2021, according to local media.
Friday 22 January 2021
NXP to highlight 5G PA modules, Wi-Fi 6E SoCs in 2021
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Friday 22 January 2021
Kinsus to expand ABF substrate capacity by 30% in 2021
Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
Friday 22 January 2021
Pegatron sees slowdown in orders for iPhone 12 mini
Pegatron has seen a slowdown in orders for the iPhone 12 mini as sales of the model in the US and Europe are affected negatively by the COVID-19 pandemic, according to industry sou...
Thursday 21 January 2021
No capacity overbooking seen for high-end PCB products
Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...
Thursday 21 January 2021
Qualcomm rolls out new 7nm 5G smartphone chip
Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology.
Thursday 21 January 2021
MediaTek launches 6nm 5G SoC chips
MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology.