Judging from MediaTek's product roadmap, the chipmaker is expected to unveil the upgraded versions of its Dimensity 800 and 700 5G SoC lineups in second-quarter 2021, according to...

Though it remains uncertain when 5G commericial will start in India, 5G smartphone sales in the country will still see rapid growth in 2021, according to local media.

Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.

Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...

Pegatron has seen a slowdown in orders for the iPhone 12 mini as sales of the model in the US and Europe are affected negatively by the COVID-19 pandemic, according to industry sou...

Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...

Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology.

MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology.

Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and WinWay Technology have both obtained major orders for MediaTek's new-generation 5G SoC chips slated...

Taiwan-based server makers including Quanta Computer, Inventec, Wiwynn, Mitac Computing Technology and Foxconn Technology are optimistic about their business prospects this year with...

Chunghwa Telecom (CHT) has announced a NT$300 million (US$10.71 million) investment project that will establish basic telecom infrastructure, cloud servers and 5G networks in an AIoT...

Far EasTone Telecommunications (FET) expects to see the user number of its 5G services to top one million or 20-30% of its total mobile subscribers by year-end 2021, after having...

The supply of more lucrative high-end ABF substrates for use in HPC, server and 5G networking chips has been increasingly short of demand due partly to insufficient yield rates at...

Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.

The semiconductor industry has seen some major players committing significant sums for R&D, such as TSMC announcing to inject a record-high capex of up to US$28 billion in 2021...