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Monday 8 February 2021
5G optical transceiver demand rebounding
Demand for optical transceiver modules for 5G base station applications has rebounded along with the continued buildups of 5G infrastructure in China, according to sources at the...
Friday 5 February 2021
Wire-bonding capacity to stay short of demand throughout 2021
ASE Technology Holding will see its wire-bonding capacity run at full utilization and remain short of demand through the end of 2021, and up to 90% of clients have signed two-year...
Thursday 4 February 2021
Order visibility for passive component materials clear for 3-4 months
Taiwan's suppliers of upstream materials for passive components have seen clear order visibility for 3-4 months ahead thanks to a significant ramp-up in demand for MLCCs, chip resistors...
Thursday 4 February 2021
Copper foil makers Co-Tech, Nan Ya keen on capacity expansions
As demand has outgrown supply for copper foil needed to support booming 5G infrastructure, automotive and consumer electronics applications, Taiwan's makers including Co-Tech Development...
Thursday 4 February 2021
Win Semi expects PA shipments for 5G handsets to double in 2021
GaAs foundry Win Semiconductors expects sales of power amplifiers (PA) for 5G handsets to climb to 30-40% of its total PA revenues in 2021, with shipments for Wi-Fi 6E applications...
Thursday 4 February 2021
Apple takes smartphone AP revenue leadership in 3Q20
The global smartphone applications processor (AP) market grew 32% in revenue terms to a record high of US$7.4 billion in the third quarter of 2020, according to Strategy Analytics...
Wednesday 3 February 2021
Unimicron, Kinsus set to gain from MediaTek mmWave chips
Taiwan's IC substrates makers including Unmicron Technology and Kinsus Interconnect Technology are poised to embrace new business opportunities arising from MediaTek stepping up its...
Wednesday 3 February 2021
Taiwan CCL makers to raise prices to reflect rising materials costs
Taiwan-based CCL makers including Elite Material, Iteq, Taiwan Union Technology and Ventec International are set to raise their quotes soon to reflect rising costs for copper foil...
Wednesday 3 February 2021
Taiwan startup develops 5G private network simulation solutions
A Taiwan-based startup is ready to launch terminal simulation systems and 5G vertical applications to help local companies accelerate related efforts to develop, build, operate and...
Tuesday 2 February 2021
Kinsus swings to profit in 2020 on robust BT, ABF substrates sales
IC substrate supplier Kinsus Interconnect Technology swung to net profit of NT$541 million (US$19.3 million) in 2020 from loss of NT$2.025 billion a year earlier, mainly driven by...
Tuesday 2 February 2021
DDI backend houses to further raise quotes later in 1Q21
Display driver IC (DDI) backend specialists including Chipbond Technology and ChipMOS Technologies plan to enforce a second wave of price hikes in late February or early March to...
Tuesday 2 February 2021
Inductor makers set to expand capacities amid increasing demand
Taiwan's inductor makers are expected to sustain high capacity utilization in most of 2021, and will move to enforce capacity expansions later in the year to meet strong demand from...
Tuesday 2 February 2021
MediaTek unveils 5G modem with mmWave support
MediaTek has announced its new M80 5G modem which combines mmWave and sub-6GHz technologies onto a single chip.
Monday 1 February 2021
Adlink develops swarm autonomy solution
Industrial computing device maker Adlink Technology has developed a swarm autonomy solution for factories of the future (FoF), featuring harmonious collaboration among a swarm of...
Monday 1 February 2021
Rapid development of 5G applications prompts urgent need for devices to obtain IoT cybersecurity certification
Connected devices for a diversity of applications are burgeoning thanks to widespread availability of 4G communication. As these connected devices are everywhere in our daily lives,...