Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...

NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...

The global market for ultra-large-sized TVs continues to grow, with leading brands such as Samsung Electronics, TCL, and Hisense all launching massive 115 or 116-inch screens in 2025...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...

Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...

Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...

The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...

According to UBI Research, BOE will supply OLED panels for Apple's iPhone 17 Pro. This marks BOE's first time providing LTPO OLEDs to Apple and highlights the growing influence of...

Intel has announced a series of senior leadership appointments aimed at advancing its core product business, scaling its foundry operations, and reinforcing engineering capabilities...

Apple's much-anticipated annual event is scheduled for September 10 at 1 a.m. Taiwan time, where several new products, including the iPhone series, Apple Watch, and AirPods Pro, are...

Samsung Electronics is reportedly expected to feature its in-house application processor (AP), the Exynos 2600, in the upcoming Galaxy S26 flagship series scheduled for early 2026...

Broadcom delivered strong earnings guidance with its latest results, as CEO Hock Tan revealed a US$10 billion ASIC mass-production order from a major new customer outside the core...