Japanese semiconductor manufacturer Renesas Electronics has disclosed a challenging beginning to 2025, revealing a decline in revenue and a sharp drop in profitability for the first...

India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...

As Taiwan seeks to strengthen its position in the global semiconductor race, the government is shifting its focus toward homegrown innovation. Taiwan's Ministry of Economic Affairs...

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...

Alphabet CEO Sundar Pichai underscored the company's accelerating progress in artificial intelligence infrastructure, product leadership, and autonomous mobility during its third...

Taiwanese semiconductor group Egis Technology held its annual "2025 Egis Tech Day" on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of "fully activated...

Pegatron has revealed progress on its US manufacturing expansion, announcing that its Texas factory is set to begin mass production in March 2026. The facility will produce Nvidia's...

Skyworks Solutions and Qorvo have agreed to merge in a cash-and-stock transaction valued at about US$22 billion, forming a US-based leader in high-performance radio frequency (RF),...

Leading South Korean conglomerate heads are set to engage in intensive "corporate diplomacy" during the 2025 Asia-Pacific Economic Cooperation (APEC) summit, meeting with global leaders...

In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...

Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...

Advanced packaging will drive AI chip performance upgrades, with new routes emerging in both materials and packaging architectures.

The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan...

Although Chinese panel manufacturers have recently gained market share, their profitability has been weak due to the high proportion of low-priced products. In contrast, South Korean...