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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 17 November 2022
Smartphone AP shipments to China up in 3Q22 with MediaTek gaining share, says DIGITIMES Research
Shipments of application processors (APs) used in smartphones released by China-based brands went up 10.2% sequentially, but down 19.4% on year to reach 199.5 million units in the...
Thursday 17 November 2022
Arm to snatch large market shares in server and PC by 2026, says Canalys
In four years the Arm architecture will take over half of the market shares in the cloud server market and 30% of the PC market, according to Steve Brazier, president and CEO of market...
Thursday 17 November 2022
Nvidia announces financial results for third quarter of FY23
On November 16, Nvidia reported its third-quarter financial results for the fiscal year 2023 (07/2022-10/2022). It reported a revenue of US$5.93 billion, a 17% YoY decrease, and a...
Thursday 17 November 2022
Micron cutting further DRAM and NAND wafer starts
Micron Technology is reducing DRAM and NAND wafer starts by approximately 20% versus fiscal fourth-quarter 2022 and is also working toward additional capex cuts. The moves are to...
Thursday 17 November 2022
TSMC to make latest Qualcomm flagship smartphone chips
TSMC is reportedly contracted to manufacture Qualcomm's latest flagship chipset - the Snapdragon 8 Gen 2 - using 4nm process technology, according to industry sources.
Wednesday 16 November 2022
Liteon accelerates global diversified operation; second phase of Vietnam plant inaugurated
Liteon Technology announced that the second phase of its manufacturing facility in Haiphong, Vietnam, was officially inaugurated. As an overseas demonstration of Liteon towards Industry...
Wednesday 16 November 2022
IC design talent unlikely to be axed despite downturn
With display driver IC (DDI) supplier FocalTech Systems announcing plans to lay off 10-15% of employees and reduce pays for all its senior executives, market concerns are rapidly...
Wednesday 16 November 2022
Rohm to team up with Shenzhen chipmaker for SiC power devices
Rohm Semiconductor has struck a strategic cooperation agreement with China's Shenzhen-based BASiC Semiconductor under which the pair will jointly develop SiC power devices for electric...
Wednesday 16 November 2022
BYD again terminates IPO plan for semiconductor business
As rapidly rising sales of new energy vehicle (NEV) keep driving demand for auto chips, BYD, the largest NEV seller and manufacturer in China, has decided to delay its IPO plan for...
Wednesday 16 November 2022
WPG sees inventory peak
IC distributor WPG expects inventories across mass-market industry supply chains to peak throughout the second half of 2022.
Wednesday 16 November 2022
Qualcomm unveils Snapdragon 8 Gen 2 for premium smartphones
Qualcomm Technologies has introduced its latest premium mobile platform, Snapdragon 8 Gen 2, which it says will define a new standard for connected computing, engineered with groundbreaking...
Wednesday 16 November 2022
NVIDIA releases H100, Quantum-2 systems and Omniverse opens portals
At SC22, the international conference on high-performance computing, NVIDIA announced broad adoption of its next-generation H100 Tensor Core GPUs and Quantum-2 InfiniBand, including...
Wednesday 16 November 2022
PMIC suppliers expect inventory correction to end by 2Q23
Power management IC (PMIC) suppliers expect the ongoing inventory adjustments across the industry supply chain, except those for automotive applications, to not end until the second...
Wednesday 16 November 2022
Taiwan IC substrate suppliers to ramp up capex in 2023
Taiwan-based IC substrate suppliers are expected to continue ramping up their capital expenditures (capex) next year to build additional production capacities for ABF substrates,...
Tuesday 15 November 2022
IC designers with parent support could better withstand headwinds
Vendors of consumer ICs are struggling against the bleakest-ever market sales, but those affiliated with major business groups or having good supply chain partners would more likely...