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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 27 December 2021
Floods in Malaysia to worsen chip shortages
Floods that hit multiple regions in Malaysia recently are expected to significantly undermine global chip supply on top of the existing shortages.
Monday 27 December 2021
Chipmakers to face increasingly volatile market scenarios in 2022
Foundries and IC designers are set to face increasingly volatile market conditions in 2022, as strong demand seen in 2020-2021 is expected to start softening at a slow pace, US-China...
Monday 27 December 2021
Taiwan to tighten reviews on semiconductor and LCD tech transfer to China
Taiwan is tightening its control over semiconductor and LCD-panel technology transfer to China, seeking to examine investments, mergers and acquisitions involving Chinese individuals...
Monday 27 December 2021
Premium heat treatment tool for semiconductor industry application
BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor...
Monday 27 December 2021
SK Hynix wins China approval to take over Intel NAND business
The Chinese authorities have granted SK Hynix merger clearances for its acquisition of Intel's NAND memory and storage unit with conditions, a move some industry analysts say would...
Friday 24 December 2021
South Korean chip designers pressured by semiconductor IP price hike
The continuing price hike of overseas semiconductor intellectual property (IP) could force small- and medium-sized IC design houses in South Korea to give up cutting-edge process...
Friday 24 December 2021
Taiwan faces challenges in SiC development
Taiwan is currently lagging in the development of the third-generation semiconductor silicon carbide (SiC), which has grown popular for its potential applications in 5G communications,...
Friday 24 December 2021
Taiwan backend houses step up deployments for 3rd-gen semiconductors
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Friday 24 December 2021
2021 Asia tech M&A deals and values hit new high
Technology merger and acquisition activities accelerated in 2021 and deals in Asia broke the US$100 billion mark for the first time in history, totaling US$137.3 billion, up 86.3%...
Thursday 23 December 2021
Highlights of the day: Memory demand from datacenters to rise in 1Q22
DRAM and NAND flash contract prices are poised to continue trending downward in first-quarter 2022, but memory demand...
Thursday 23 December 2021
GlobalWafers to ramp up production for 3rd-gen semiconductors in 2022
GlobalWafers, a subsidiary of solar wafer maker Sino-American Silicon Products (SAS), plans to more than double production capacity for third-generation semiconductors in 2022, according...
Thursday 23 December 2021
Taiwan IC design houses to accept foundry price hikes
Taiwan-based IC design houses including first-tier players are aware they will have to accept price increases proposed by pure-play foundries in order to obtain more available fab...
Thursday 23 December 2021
TAS sets up subsidiary for compound semiconductors
ProAsia Semiconductor (PASC), a wholly-owned subsidiary of Taiwan Asia Semiconductor (TAS, formerly Opto Tech), will be engaged in compound semiconductor R&D and production with...
Wednesday 22 December 2021
EMC to issue bonds for capacity expansion on IC substrate CCLs
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Wednesday 22 December 2021
BESI lowers 4Q21 revenue due to severe flooding in Malaysia
Leading manufacturer of assembly equipment for the semiconductor industry, BE Semiconductor Industries N.V. (Besi) announced that due to flooding affecting its main production facility...