Leading manufacturer of assembly equipment for the semiconductor industry, BE Semiconductor Industries N.V. (Besi) announced that due to flooding affecting its main production facility...

As Wi-Fi technology standards continue to advance from Wi-Fi 5 and Wi-Fi 6/6E to Wi-Fi 7, high-frequency and mixed-frequency chips testing interfaces are badly needed to help chipmakers...

The semiconductor industry experienced a dramatic year in 2021 - climate crises, pandemic, fire at a Japanese chip factory, geopolitical tension, and automakers' decision-making error...

Billings among North American manufacturers of semiconductor production equipment climbed to a record high of US$3.93 billion in November 2021, according to SEMI.

Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...

IC Insights has forecast that 17 companies will have worldwide semiconductor (IC and OSD - optoelectronics, sensor, and discrete) sales of more than US$10.0 billion in 2021.

Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...

Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...

UMC has informed clients of another round of price hikes in March 2022, following an about 10% rise in foundry service...

Small- to medium-size LCD panel and module maker Giantplus Technology has seen brisk order visibility for the first half of 2022, with industrial and niche-market products accounting...

MCU specialist Nyquest Technology has struck an agreement with Nuvoton Technology for sufficient foundry capacity over the next four years, according to the fabless chipmaker.

Broadcom and MediaTek are set to release their respective Wi-Fi 7 SoC series in the first half of 2022, looking to build a preemptive presence in the next-generation Wi-Fi segment...

The wide bandgap (WBG) features of third-generation semiconductors make them particularly suitable for recharging and radio frequency (RF) applications, as silicon carbide (SiC) has...

DIGITIMES estimates that it costs US$2.4 billion to build a 12-inch wafer fab using the 90nm process node with a monthly output of 50,000 wafers. The investment can reach US$6 billion...

Delivery lead times for Wi-Fi 6/6E core chips still last six months to one year although such chips are given shipment priority at vendors amid tight foundry capacity, and migrating...