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IN THE NEWS
Tuesday 29 August 2017
LGD to double OLED TV panel production capacity by 2019
LG Display will double its OLED TV panel production capacity to 120,000 substrates a month in 2019, when its new 8.5G production line in Guangzhou, China comes online, according to...
Tuesday 29 August 2017
MediaTek launches SoCs for mid-range smartphones
MediaTek has introduced new members of its Helio chipset family, the P23 and P30 system-on-chips (SoCs), designed to deliver performance and power efficiency, dual camera photography,...
Tuesday 29 August 2017
E-paper startup Linfiny to focus on e-notebook development
EPD (electrophoretic display) e-paper startup Linfiny, a joint venture between E Ink Holdings (EIH) and Sony Semiconductor Solutions, will officially kick off its operations in the...
Tuesday 29 August 2017
Samsung to expand NAND chip capacity in China
Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...
Tuesday 29 August 2017
Silicon Works striving for orders from China, Taiwan
Korea-based Silicon Works is striving for orders from China- and Taiwan-based panel vendors, and intends to reduce its reliance on orders placed by LG Display, according to a Korea-based...
Tuesday 29 August 2017
Nidec to acquire SV Probe
Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...
Monday 28 August 2017
Lite-On Semi obtains GPP diode orders from major China smartphone vendors
Lite-On Semiconductor with its GPP (glass passivated package) bridge rectifiers has entered the supply chain of major China-based smartphone vendors including Huawei, Oppo, Vivo and...
Friday 25 August 2017
Xintec loss widens in 1H17
Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.
Friday 25 August 2017
Alchip posts EPS of NT$1.53 for 2Q17
Alchip Technologies, a Taiwan-based provider of ASIC/SoC design services, saw its EPS hit a nearly 3-year high of NT$1.53 (US$0.05) in the second quarter of 2017.
Thursday 24 August 2017
China AI startup Cambricon receives new funding of US$100 million
China-based AI chip startup Cambricon Technologies has newly raised US$100 million in series A round funding to support its development of advanced AI chips, which is expected to...
Thursday 24 August 2017
CPT to begin volume shipments of 18:9 smartphone panels in 4Q17
Chunghwa Picture Tubes (CPT) will begin volume shipments of 18:9 all-screen smartphone panels in the fourth quarter of 2017, with the bulk of the production coming out from its plant...
Thursday 24 August 2017
BOE to catch up with LGD in large-size LCD panel unit shipments
China-based BOE Technology will see unit shipments of its large-size LCD panels reach nearly those shipped by LG Display in 2017, and is also likely unseat LGD to become the world's...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Thursday 24 August 2017
Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8
Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...
Thursday 24 August 2017
Semiconductor industry capital spending to rise 20% in 2017, says IC Insights
IC Insights has revised its outlook for semiconductor industry capital spending to 20% growth in 2017. Spending for the first half of 2017 was already 48% greater than a year ago,...