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IN THE NEWS
Friday 18 August 2017
Mirle seeing order backlog swell, says report
Semiconductor and LCD panel equipment supplier Mirle Automation has seen its backlog of orders exceeding NT$10 billion (US$329.7 million), according to a recent Chinese-language Economic...
Friday 18 August 2017
Dialog looking to extend partnership with Spreadtrum
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Thursday 17 August 2017
Micron advances semiconductor R&D capabilities with new Boise facility
Micron Technology has announced the opening of a new facility which will play a critical role in the company's research into breakthrough new memory and storage technologies of the...
Thursday 17 August 2017
Tsinghua Unigroup chief pledges firm support for Spreadtrum against mobile chip rivals
China's state-backed tech conglomerate Tsinghua Unigroup will render persistent support to its subsidiary Spreadtrum Communications to counter increasingly fierce competition in the...
Thursday 17 August 2017
China market: MediaTek to roll out new Helio P series for mid-range smartphones
MediaTek has sent out invitations for a product event to be held in Beijing on August 29, when the company will introduce its new Helio P23 and P30 series designed for mid-range smartphones,...
Thursday 17 August 2017
Nvidia overtakes MediaTek as 3rd largest IC design company
Nvidia overtook MediaTek as the world's third-largest IC design company in terms of revenues in the second quarter of 2017, according to research firm Topology Research Institute...
Thursday 17 August 2017
Egistec to post brisk 3Q17 revenues
Fingerprint sensor supplier Egis Technology (Egistec) is expected to post brisk sales results for the third quarter of 2017, thanks to a pick-up in customer demand, according to a...
Wednesday 16 August 2017
ASE output hit by power outage
A sudden massive blackout took place in Taiwan on August 15 which hit Advanced Semiconductor Engineering's (ASE) plants in Kaohsiung. The incident will likely result in losses of...
Wednesday 16 August 2017
Digitimes Research: 16-line and below LiDAR sensor segment to see intense competition
As automakers generally expect LiDAR (light detection and ranging) sensor prices to be below US$1,000, suppliers tend to reduce the number of laser beams and mechanical components...
Wednesday 16 August 2017
Sunplus tapping deeper into automotive electronics segment
IC design house Sunplus Technology has obtained chip orders for advanced driver assistance systems (ADAS) and other car electronics applications from China- and Japan-based vendors,...
Wednesday 16 August 2017
Taiwan science ministry to enforce 4-year AI chips research project
Taiwan's Ministry of Science and Technology has decided to implement a four-year "Semiconductor Moonshot Project" to encourage university professors to lead students in researching...
Wednesday 16 August 2017
Niche-IC distributors to enjoy strong 2H17
Taiwan-based niche-market IC distributors including Answer Technology (ANStek) and Edom Technology are expected to enjoy brisk revenue results for the second half of 2017, driven...
Wednesday 16 August 2017
HiSilicon among top-5 customers of TSMC
With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's (TSMC) top-5 customers, according...
Wednesday 16 August 2017
DRAM best-growing IC in 2017, says IC Insights
Five out of the 33 IC market segments tracked by IC Insights will outpace the 16% growth forecast for the total IC market in 2017 compared to 2016, according to the market research...
Wednesday 16 August 2017
Spreadtrum to roll out 12nm AI chips in 2018
Spreadtrum Communications plans to launch its 12nm mobile chips for artificial intelligence (AI)-based smartphones in 2018, according to company CEO Leo Li.