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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 25 April 2018
Component orders for new iPhone to not pick up till mid-3Q18, say sources
Speculation about Apple cutting back its orders for iPhone devices and related components has been fueled by revelations by more Taiwan-based suppliers that their orders from the...
Wednesday 25 April 2018
Worldwide semiconductor revenues increase 21.6% in 2017, says Gartner
Driven by strong growth in the memory market, worldwide semiconductor revenues totaled US$420.4 billion in 2017, a 21.6% increase from 2016 revenues of US$345.9 billion, according...
Tuesday 24 April 2018
Andes silicon IP chip shipments to hit 800 million mark in 2018
Taiwan-based CPU IP provider Andes expects to see shipments of its silicon IP chips hit the 800 million mark in 2018, according to company president Frankwell JM Lin.
Tuesday 24 April 2018
IC testing firm CHPT operates at nearly full utilization
IC testing solution provider Chunghwa Precision Test Tech (CHPT) has seen production lines for smartphone-use application processors run at nearly full capacity, according to company...
Monday 23 April 2018
8-inch wafer capacity to remain tight by 2020 on explosive IoT demand
As IoT (Internet of Things) chips currently rely largely on 8-inch wafer fabs for fabrication, the increasing demand for such chips will keep such fabs in Taiwan and China running...
Monday 23 April 2018
Shipment prospects bright for TDDI, AMOLED driver ICs
The increasing popularity of all-screen and AMOLED smartphone panels will boost global shipments of TDDI (touch and display driver integration) chips and AMOLED driver ICs in 2018...
Monday 23 April 2018
IDMs, Taiwan IC firms gearing up to develop car-use SiC power devices
With silicon carbide (SiC) emerging as an increasingly popular third-generation semiconductor material for car-use power devices and 5G networks, international major IDMs such as...
Friday 20 April 2018
Phison expects to post over 10% revenue growth in 2Q18
Phison Electronics has enjoyed a pull-in of short lead-time orders for NAND flash products, and is optimistic that demand will continue to improve later in the second quarter, according...
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Friday 20 April 2018
TSMC cuts revenue outlook for 2018
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its revenue growth forecast for 2018 to 10% from the previously-estimated 10-15%, citing weaker-than-expected smartphone...
Friday 20 April 2018
TI, Taiwan makers team up to develop car electronics solutions
Texas Instruments (TI) and member firms of a new generation driver platform R&D alliance set up in Taiwan three years ago have jointly developed a spate of automotive electronics...
Friday 20 April 2018
Taiwan panel makers likely to incur losses on falling panel prices
Most Taiwan-based LCD panel makers are likely to start incurring losses from the second quarter of 2018 ending their seven quarters of consecutive profit gains, as increasing output...
Friday 20 April 2018
Android phone makers to not launch 3D sensing models until 3Q18, says Digitimes Research
The world's first Android-based smartphone with 3D facial recognition technology is unlikely to hit the market until the third quarter of 2018 due to insufficient capability to integrate...
Thursday 19 April 2018
Taiwan IC designers asked to defer shipments of mining chips
Taiwan-based IC design houses have received requests from customers in the cryptocurrency mining sector to defer shipments of mining ASICs amid lackluster replacement demand for mining...
Thursday 19 April 2018
TSMC reports EPS of NT$3.46 for 1Q18
Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.79 billion (US$3.06 billion) for the first quarter of 2018, down 9.6% sequentially but up 2.5%...