CONNECT WITH US
Tuesday 3 February 2026
Huawei-linked Hubble invests in automotive chipmaker Norelsys pre-IPO

Norelsys (Tianjin) Co., Ltd. has begun IPO counseling after filing registration for listing guidance with the Tianjin branch of the China Securities Regulatory Commission, according to regulatory disclosures.

Tuesday 3 February 2026
Shanghai fast-tracks 'Oriental IC Port,' adds fourth-gen semiconductors to roadmap

China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer interfaces (BCIs) and fourth-generation semiconductors among its priority future industries, signaling early preparation for a new materials era beyond third-generation semiconductors.

Tuesday 3 February 2026
Ample Electronic expects quarterly growth as silver price drop prompts passive component clients to resume orders
Ample Electronic Technology, a major upstream manufacturer of conductive pastes for passive components, said that the sharp decline in silver has revived downstream customers' ordering momentum. Despite seasonal factors affecting February, the company remains optimistic about strong shipment demand in the first quarter of 2026, likely matching the fourth quarter of 2025 and supporting steady quarterly growth for the full year.
Tuesday 3 February 2026
C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750 square feet) production site in Nantun, Taichung, Taiwan. The expansion is intended to support the development of next-generation process equipment for artificial intelligence (AI) advanced packaging without disrupting existing plant operations in Taichung.
Tuesday 3 February 2026
Sumitomo Bakelite to acquire Kyocera unit, paving way for Chang Wah expansion
Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies' product lines are highly complementary, positioning the deal to deliver stronger synergies. Leveraging Kyocera's strengths in discrete and power products in China is expected to support Sumitomo Bakelite's global market expansion.
Monday 2 February 2026
Kinsus approves US$744M ABF expansion on clear three-year demand outlook
Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment purchases over the next three years. The expansion will be located at its Plant 6 facility in Yangmei, Taoyuan, with monthly output expected to increase by about 25% by 2027.
Monday 2 February 2026
Chinese process control powerhouse Jingce targets nearly triple profit growth in 2025
Wuhan Jingce Electronic Group forecasts net profit of CNY80 million to CNY90 million (approx. US$11.5 million to US$13 million) for 2025, representing year-over-year growth of 181.97% to 192.21%. Net profit excluding non-recurring items is expected to reach CNY21.66 million to CNY31.66 million, up 113.66% to 119.97%, reversing losses from the previous year.
Monday 2 February 2026
Semco's Tianjin MLCC plant capacity runs flat out on EV, AI server expansion
Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines, with about 8,000 workers running operations 24 hours a day. The Tianjin site is Semco's largest global manufacturing base, focused primarily on automotive MLCCs while also supplying consumer electronics and server markets.
Monday 2 February 2026
Taiwan PCB makers vie for AI server market with new 2026 capacity
As demand for AI infrastructure continues to grow steadily, major networking and server PCB suppliers such as Gold Circuit Electronics (GCE), First Hi-tec (FHt), and Allied Circuit (ACCL) have benefited from a significant uptick in shipments of high-end boards, pushing full-year 2025 revenue to record highs.
Friday 30 January 2026
ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight. The primary bottleneck stems from continuously expanding chip sizes, which introduce warpage and thermal stress challenges while driving ABF substrate demand to multiply, creating structural supply pressure and underpinning a recovery in 2025 operations for Taiwan's three leading IC substrate makers.

Friday 30 January 2026
DRAM price surge ripples downstream as CWE plans EMC hike
The recent surge in DRAM prices is widening pricing headroom across the semiconductor supply chain, prompting Chang Wah Electromaterials (CWE), a major semiconductor materials supplier and distributor, to plan price increases for epoxy molding compound (EMC) starting in March 2026.
Thursday 29 January 2026
Cmsemicon triggers MCU, NOR Flash price hikes of up to 50% in widening China chip cost cycle
Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs. The company said the adjustment is part of a broader price increase cycle across China's semiconductor sector in early 2026, which began with AI processors and memory products and has since extended to wafer fabrication, backend services, and upstream materials and components.
Thursday 29 January 2026
Elite Material Co. invests in Taoyuan to boost high-end PCB production for AI demand
Elite Material Co. (EMC), a leading copper-clad laminate (CCL) manufacturer, has acquired land and buildings in Taiwan's Taoyuan Guanyin Industrial Park from Far Eastern New Century Corporation for NT$2.78 billion (US$88.5 million). The purchase supports EMC's plans to expand production capacity to meet growing demand for high-end printed circuit board (PCB) materials driven by artificial intelligence (AI) applications.
Wednesday 28 January 2026
Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai has outlined breakthroughs in FOPLP technology and expansion plans. After solving warpage in manufacturing, Powertech is targeting yield rates of 95-98%.
Wednesday 28 January 2026
MediaTek partners with Google, targets US$10 billion ASIC business by 2027
MediaTek's performance in ASICs has been the center of market interest as it continues to heavily invest in Taiwan and North America to break into the cloud AI market. Rumors have risen that the ASIC business could potentially be worth US$10 billion by 2027.
Tuesday 27 January 2026
Semco reports record revenue for 2025, driven by AI and automotive sectors
Samsung Electro-Mechanics (Semco) achieved a record annual revenue of approximately KRW11.31 trillion (approx. US$7.79 billion) in 2025, marking a 10% increase from the previous year, propelled by strong demand for AI and server multilayer ceramic capacitors (MLCCs), according to reports from Money Today and ZDNet Korea. Operating profit climbed 24% to KRW913.3 billion, while quarterly results also showed significant growth.
Tuesday 27 January 2026
China reportedly enters semiconductor glass substrate market
China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
Tuesday 27 January 2026
TPCA predicts 13.9% rise in global PCB market in 2026 amid AI-driven capacity shift
The rapid expansion of artificial intelligence (AI) computing is fueling a new wave of structural growth in the global printed circuit board (PCB) industry.
Tuesday 27 January 2026
AI and localization reshape China's semiconductor supply chain as price hikes arrive
After navigating pandemic tailwinds, US-China conflicts, and tariffs under US President Donald Trump, the global semiconductor and electronics industries are emerging from inventory adjustments and price bottoms starting in 2025. While China's electronics sector has yet to fully recover, AI infrastructure, high-performance computing (HPC), automotive, and industrial control applications are driving a new AI-led pricing cycle across components and semiconductor supply chains.
Tuesday 27 January 2026
Yageo leads chip resistor price hikes, Walsin follows
Price increases are spreading through the passive components industry as clearer pricing signals from market leaders accelerate the trend across the supply chain. Products ranging from tantalum capacitors and ferrite bead inductors to chip resistors are seeing broad-based adjustments.
Monday 26 January 2026
TAISIC Materials shifts focus to high-end SiC substrates
Facing intense price competition from Chinese manufacturers in the silicon carbide (SiC) substrate market, Kenmec Mechanical Engineering's subsidiary TAISIC Materials is pursuing a targeted strategy emphasizing high-end niche applications and advanced R&D. This approach diverges from scale-based price competition and aims to redefine SiC's functional value within specialized technology sectors.
Monday 26 January 2026
Jabil names longtime director Steve Raymund chair
Jabil said on January 22, 2026, that longtime director Steve Raymund has been appointed chairman of its board, while Thomas T. Edman and Raejeanne Skillern have joined as new directors.
Monday 26 January 2026
LG Display pushes into glass interposers as Korean panel makers seek growth
LG Display is moving from research toward execution in the emerging glass interposer market, working with domestic glass-processing partners to apply its display manufacturing experience to semiconductor materials, according to South Korean media reports.
Monday 26 January 2026
Commentary: China's RISC-V progress from C-Sky to T-Head
Alibaba is rumored to be evaluating a plan to spin off T-Head Semiconductor for a potential listing. T-Head may still appear to be a young company, but to the semiconductor industry, this Chinese IC design company's roots span more than twenty years of transformation and arduous progress. Its predecessor, C-Sky Microsystems, also plays an important role in China's development of the RISC-V architecture. In review of its evolution, the reason why Alibaba chose this critical moment to push this team onto center stage has become clear.
Saturday 24 January 2026
Energy limits AI growth; geopolitical stakes in rare earths, new packaging innovations reshape global supply chains
The Global Electronics Association's latest "2026 Electronics Industry Trend Forecast" highlights critical challenges and shifts that will impact the sector over the next few years. Chief among these are energy infrastructure constraints that are throttling AI expansion, a move toward strategic interdependence in regional supply chains, and advancements in packaging technologies that are transforming industry dynamics. These developments signal substantial changes in investment approaches, geopolitical relations, and manufacturing policies worldwide.