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Tuesday 16 September 2025

Yageo targets active component growth with Anpec Electronics stake acquisition

Taiwanese passive component manufacturer Yageo Corporation has announced plans to acquire up to 28.5% of power management IC (PMIC) design firm Anpec Electronics through a public tender offer valued at approximately NT$4.89 billion (approx. US$161.9 million). This marks Yageo's continued shift toward expanding its presence in active components following its recent acquisition of Japan's Shibaura Electronics.

Tuesday 16 September 2025

SEMICON Taiwan 2025: UK seeks Taiwanese partnerships to overcome domestic chip manufacturing constraints

The United Kingdom demonstrated a prominent presence at SEMICON Taiwan 2025 last week, reinforcing its position as a key player in innovative technology. The UK Department for Business and Trade and Innovate UK, the national innovation agency, led a delegation of over 30 emerging companies across semiconductor manufacturing, design, testing, and materials sectors to the event.

Tuesday 16 September 2025

South Korea's August ICT exports hit record high, Taiwan surge drives growth

South Korea's information and communications technology (ICT) exports in August 2025 reached a record high for the period compared to previous years. Due to rising memory semiconductor prices and increased investment in artificial intelligence server infrastructure, semiconductor export values also reached an all-time high.

Tuesday 16 September 2025

SEMICON Taiwan 2025: TSMC's GaN retreat opens door for Chinese SiC competitors

Power semiconductors, particularly silicon carbide (SiC) and gallium nitride (GaN), emerged as key themes at SEMICON Taiwan 2025. The toughest competition was in SiC equipment, with Chinese, US, and Japanese suppliers all aggressively fighting for market share.

Tuesday 16 September 2025

China's SiC pricing war forces Japan to retreat while Europe holds its line

A new phase in the global race for silicon carbide (SiC) dominance is unfolding—one shaped as much by geopolitics as by market forces. As Chinese manufacturers make rapid strides in low-cost SiC wafer production, the strategic consensus around this next-generation semiconductor material is beginning to fracture.

Tuesday 16 September 2025

Han's Laser expands from semiconductors to new markets, as industrial laser demand slides

The booming semiconductor industry has led to a surge of emerging Chinese laser manufacturers, yet weaker players are being weeded out based on precision and accuracy as competition intensifies, prompting some to seek out new business opportunities.

Monday 15 September 2025

Panasonic Industry to invest in new factory in Thailand for AI server materials

Panasonic Group's subsidiary, Panasonic Industry, announced plans to construct a new factory in central Thailand with an investment of JPY17 billion (approx. US$115 million). The facility will produce multilayer circuit board materials specifically designed for artificial intelligence (AI) servers, addressing the surging global demand driven by generative AI technologies.

Monday 15 September 2025

Weekly news roundup: Tech giants pivot and partner as AI demand collides with geopolitical reality

Below are the most-read DIGITIMES Asia stories from the week of September 8–September 14.

Sunday 14 September 2025

Navitas expands GaN, SiC push from consumer electronics to AI data centers

Navitas Semiconductor is expanding its portfolio beyond consumer chargers to include advanced power solutions for solar inverters, motor drives, and AI data centers, Senior Field Applications Engineering Manager Rome Luo said. Speaking at SEMI-e 2025, Luo noted that the company has shipped over 300 million gallium nitride (GaN) devices, achieving high yields and very low failure rates in the field.

Sunday 14 September 2025

Taiwan's OtO Photonics gains edge in China's semiconductor market with spectrometer focus

At the packed China International Optoelectronic Exposition (CIOE) held at the Shenzhen World Exhibition & Convention Center, Taiwan's OtO Photonics stood out for its specialized focus on spectrometers. With over 3,800 exhibitors in attendance, OtO has carved out a leading role in the industry.

Friday 12 September 2025

China's self-sufficiency agenda spurs JPT's leap into optical inspection

Shenzhen JPT Opto-Electronics, a well-established name in China's laser industry, is expanding into optical inspection as Beijing's push for supply chain localization gains momentum. Having entered the photonic inspection field in 2016, the company now sees strong growth potential as China prioritizes self-sufficiency in advanced manufacturing.

Friday 12 September 2025

China's Lightstar targets record localization in optical passive components amid tariff pressures

China's drive for technology self-sufficiency is transforming the communications supply chain. Shenzhen-based Lightstar Technology expects localization of advanced optical passive components to reach record levels within the next five to ten years, with imports of specialty materials giving way to domestically produced alternatives as Beijing's push for homegrown innovation accelerates.

Friday 12 September 2025

SEMICON Taiwan 2025: CHPT enters US CSP supply chain; order visibility extends to 3Q26

Taiwanese test interface manufacturer CHPT showcased its latest innovations at SEMICON Taiwan 2025. Besides unveiling a comprehensive upgrade solution centered on "AI-driven probe card technology," President Scott Huang highlighted the technical challenges that advanced process chips—such as mobile application processors (AP) and high-performance computing (HPC) chips used in AI applications—pose to the IC testing supply chain.

Friday 12 September 2025

Yageo to acquire up to 28.5% stake in Anpec Electronics through public tender offer

Taiwan-based passive components manufacturer Yageo Corporation announced on September 11 that it plans to acquire up to 28.5% of power IC designer Anpec Electronics via a public tender offer set to commence shortly. The bid values Anpec shares at NT$229.8 (approx. US$7.6) each, a 20% premium over the current price, with the total investment estimated at around NT$4.8 billion.

Thursday 11 September 2025

SEMICON Taiwan 2025: Infineon CEO reveals future opportunities in power semiconductors

Jochen Hanebeck, CEO of Infineon, emphasized the concept "no AI without power" during his keynote speech at the SEMICON Taiwan 2025 Master Forum. Power semiconductors play a critical role across all AI application scenarios, whether in cloud AI data centers or edge physical AI applications such as electric vehicles (EVs) and robotics. Advanced power semiconductor technology is essential to improve energy efficiency and better meet real user demands.

Thursday 11 September 2025

Shenzhen Dual-expo Spotlight | China leans on laser chips to localize AI data centers and bypass tariffs

The China International Optoelectronic Exposition (CIOE) and SEMI-e 2025 Semiconductor Innovation Exhibition kicked off in Shenzhen on September 10, underscoring the laser industry's growing role in China's drive for AI sovereignty, defense technologies, optical communications, robotics, and immersive devices from AR to MR.

Thursday 11 September 2025

SEMICON Taiwan 2025: Taiwan's 10-year chip program seeks to link semiconductor supply chains among democratic countries

In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking an unprecedented scale compared to earlier initiatives. National Science and Technology Council (NSTC) minister Cheng-Wen Wu stated that the Taiwan CbI program will comprehensively strengthen the global competitiveness and resilience of Taiwan's semiconductor industry supply chain.

Thursday 11 September 2025

LCY Chemical eyes advanced chip, display materials

LCY Chemical is actively expanding into the electronic materials market in its 110th year since the company's founding in 1915. According to CEO Vincent Liu, the company's electronic materials segment currently accounts for roughly 12% of total revenue, with a compound annual growth rate of 26%, significantly higher than the industry average of 7%. Going forward, the company plans to deepen its material portfolio to target demand related to the semiconductor, AI, high-speed communications, and next-generation display industries.

Wednesday 10 September 2025

Horiba opens Taiwan lab to drive next-gen semiconductor, AI materials research

Japanese measurement leader Horiba Ltd., active in Taiwan for nearly 30 years, has opened a new Application and Solutions Platform (ASP) instrumentation lab at its Hsinchu headquarters. The facility is designed to boost Horiba Taiwan's technical services and reinforce its position in the global semiconductor and AI value chains.

Wednesday 10 September 2025

Everlight targets high-performance markets as third-gen semiconductor sales set to double in 2025

Everlight Electronics is ramping up its push into third-generation semiconductors, highlighting new research and market strategies in SiC and GaN at SEMICON 2025. The company emphasized three pillars of its expansion: competitive pricing, rapid delivery, and high-quality service, positioning itself to capture a stronger share of the next-generation materials market.

Wednesday 10 September 2025

SEMICON Taiwan 2025: Zhen Ding recasts PCBs as semiconductor engines, strikes AI factory pact with Advantech

Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from passive circuit carriers into critical enablers of computing power. Chairman Charles Shen said AI-driven advanced packaging is emerging as a core growth engine for the industry, adding that with chip complexity rising and 3D packaging gaining ground, PCBs now play a decisive role in unlocking full processing performance.

Wednesday 10 September 2025

Growth in military and semiconductor sectors fuels new momentum for IPC firms

Industrial PC (IPC) companies have begun releasing their revenue figures for August 2025. Despite challenges from the global high-interest-rate environment and geopolitical tensions, overall performance continues to demonstrate resilience through regional and application expansion. Beyond ongoing development of integrated hardware-software solutions, emerging demands in military, edge computing, and semiconductor automation are becoming key strategic focuses for these companies.

Wednesday 10 September 2025

Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced packaging industry landscape will officially enter an era dominated by three distinct powers: foundries, OSATs, and PCB manufacturers. This shift presents a rare triple growth opportunity for upstream equipment suppliers.

Tuesday 9 September 2025

DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's LX Semicon, once a dominant and long-standing supplier in the market.

Tuesday 9 September 2025

Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift

Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure expansion to end-user applications, the ecosystem now relies heavily on precision technologies, with chip-on-wafer-on-substrate (CoWoS) processes at the forefront.

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