TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.

Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...

Intel has been attempting to shift the narrative to a more positive light following the company's "gruesome" series of trainwrecks that saw a disappointing second-quarter 2024 earnings...

Is it time for Intel Foundry (IF) to be spun off as an independent entity? During the 2008-2009 financial crisis, AMD was forced to divest its wafer fabrication division, offloading...

With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...

These are the most-read DIGITIMES Asia stories in the week of August 12 – August 16.

In his 42 months as CEO of Intel, Pat Gelsinger recently issued an internal memo announcing layoffs, sharply criticizing Intel's deep-seated issues. He stated that Intel's "costs...

TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.

The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...

Following the United States and Japan, TSMC's final overseas wafer fab, ESMC (European Semiconductor Manufacturing Company), will...

The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.

TSMC's production capacity for CoWoS packaging is forecast to grow at a CAGR of more than 50% from 2023 to 2028, according to DIGITIMES Research.

TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...

The New York Times recently published a piece expressing concern about the delay in the start of chip fabrication and sale at TSMC's Fab 21 in Arizona, despite the project...

TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...