Taiwan's top-3 pure-play foundries -- TSMC, United Microelectronics (UMC), and Vanguard Semiconductor International (VIS) – are outperforming their global competitors, achieving...

In the wake of rising geopolitical tensions, Taiwan-based high-tech companies are accelerating their expansions beyond China, which used to be the base for most of their offshore...

US-based clinical research firm Thermo Fisher Scientific opened its first semiconductor laboratory, NanoPort, in Taiwan on July 26.

In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...

South Korean media have recently forecasted that the investment strategies of South Korean and Taiwanese semiconductor firms in the United States could shift depending on the outcome...

TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.

Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...

In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...

OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...

According to data from the Kyushu Bureau of Economy, Trade, and Industry, from April 2021 to June 2024, there have been 100 new semiconductor-related investments announced or reported,...

Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...

With Taiwan Semiconductor Manufacturing Company (TSMC) proposing its Foundry 2.0 model, some industry experts compare it with Intel's IDM 2.0. However, the challenges Intel faces...

TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...

TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.

With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...