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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Wednesday 8 June 2022
TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors
TSMC is unwavering in its goal of reaching 30% revenue growth by US dollars in 2022, as demand for automotive and high-performance computing (HPC) chips remains high, according to...
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Wednesday 8 June 2022
Apple orders to drive TSMC revenue CAGR through 2025
Orders for Apple's custom chips will drive TSMC's revenue through 2025 with a CAGR of 15-20%, according to industry sources.
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Monday 6 June 2022
China silicon wafer maker NSIG set to double capacity by 2024
China's National Silicon Industry Group (NSIG) has newly disclosed plans to expand production capacity for 12-inch silicon wafers at a total investment of CNY6.79 billion (US$1.017...
Monday 6 June 2022
UMC reportedly mulling 6% quote hikes for 22/28nm chips in 2023
United Microelectronics (UMC) reportedly is mulling raising its 2023 quotes by around 6% for 22/28 nm processes that have been in strong demand, despite uncertainties associated with...
Thursday 2 June 2022
TSMC to boost ties with memory chip vendors
TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Tuesday 31 May 2022
Samsung leads in DRAM market share, Micron in technology
The latest IC Insight report shows the world's top-3 DRAM makers garnered a combined 95% global market share, with Samsung Electronics taking the lead with 44%, followed by SK Hynix...
Tuesday 31 May 2022
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Friday 27 May 2022
VisEra gearing up for metalens processing nodes
TSMC subsidiary VisEra Technologies, which offers image sensor foundry, wafer-level testing and wafer-level optical film services, has said it will deepen the development of related...
Thursday 26 May 2022
Concerns rising over potential foundry overcapacity in 2024
Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...
Thursday 26 May 2022
Taiwan tech firms deepen deployments for future vehicles
Taiwan-based tech companies have stepped up their deployments for future vehicles in recent years, with TSMC, Delta Electronics, Quanta Computer, and Hon Hai Technology Group (Foxconn)...
Thursday 26 May 2022
Taiwan pure-play foundries on track to post record revenues in 2022
TSMC, United Microelectronics (UMC), and Vanguard International Semiconductor (VIS) are all on track to see their revenues hit record highs in the second quarter and all of 2022,...