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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Thursday 16 January 2014
TSMC expects another record year
Taiwan Semiconductor Manufacturing Company (TSMC), the world's biggest contract chipmaker, has reported record consolidated revenues and profits for 2013. 2014 will be another record...
Tuesday 14 January 2014
Digitimes Research: Foundry sector to outperform overall semiconductor industry in 2014
The global IC foundry sector is forecast to increase almost 9% in output value in 2014, while output value for the overall semiconductor industry will grow by a smaller 5.2%, according...
Monday 13 January 2014
TSMC to produce fingerprint sensors for next-generation iPhone at 12-inch fab
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly will begin producing fingerprint sensors for Apple's next-generation iPhone at its 12-inch fab using a 65nm process in...
Friday 10 January 2014
TSMC 4Q13 sales fall 10%, but meet guidance
Consolidated revenues at Taiwan Semiconductor Manufacturing Company (TSMC) declined 10.3% sequentially to NT$145.81 billion (US$4.855 billion) in the fourth quarter of 2013, but the...
Thursday 9 January 2014
Intel reportedly places 28nm chip orders with TSMC, Globalfoundries and UMC
Intel has contracted Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its forthcoming Atom mobile processor series codenamed SoFIA, and also placed orders for entry-level...
Thursday 9 January 2014
Samsung, TSMC and Micron top list of IC industry capacity leaders, says IC Insights
IC Insights has provided a ranking of the industry's 10 largest IC manufacturers in terms of installed capacity. Included in the list are four from North America, two from South Korea,...
Friday 3 January 2014
Equipment supplier Mirle braces for strong sales in 1H14
Mirle Automation, which makes equipment for production of semiconductors and LCD panels, will see strong sales in the first half of 2014 as its order visibility has extended to the...
Monday 30 December 2013
TSMC seeing pull-in orders from PC and smartphone chip clients
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has landed a pull-in of orders from PC and smartphone chip clients for delivery in the second half of January 2014, according...
Tuesday 24 December 2013
Rick Tsai reportedly resigns from TSMC
Rick Tsai, chairman and CEO for TSMC Solar and TSMC Solid State Lighting, reportedly has resigned from the two TSMC subsidiaries to take up the post of chairman of Chunghwa Telecom...
Tuesday 24 December 2013
TSMC Solar, TSMC Solid State Lighting chairman to become Chunghwa Telecom chairman
Rick Tsai, chairman and CEO for both TSMC Solar and TSMC Solid State Lighting, two subsidiaries of foundry service provider Taiwan Semiconductor Manufacturing Company (TSMC), will...
Wednesday 18 December 2013
Samsung, TSMC to share Apple 14/16nm chip orders
Samsung Electronics has signed a contract for the production of Apple's next-generation smartphone application processors to be used in 2015 using 14/16nm FinFET processes, according...
Monday 16 December 2013
TSMC adjusting capacity to meet rising orders for bumping services
TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture...
Monday 16 December 2013
IC supply chain looks to improved December performance
Most Taiwan-based wafer foundry houses, IC backend service companies and IC design houses are expected to report improved sales for December as compared to the previous month due...
Thursday 12 December 2013
TSMC moves 16nm FinFET to risk production
TSMC's 16nm FinFET has entered risk production, with volume production scheduled to kick off within one year, according to the foundry chipmaker. Newly-appointed co-CEO Mark Liu said...
Thursday 12 December 2013
Xilinx begins delivering 20nm chips
Xilinx has announced that it began to ship its first 20nm silicon in early November 2013, continuing to execute on an aggressive UltraScale device rollout.