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Winbond partners with OmniVision on 1.3-megapixel image module, shipments by year-end

Samson Yu and Katherine Chiu, Taipei; Chinmei Sung, DIGITIMES Asia 0

Handset customers of Winbond Electronics have entered design-in stage for 1.3-megapixel image modules. The modules, which combine an image controller chip and DRAM from Winbond and a CMOS sensor from OmniVision Technologies, may start mass production...

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