CONNECT WITH US

IC-substrate makers report rise in orders from networking chipmakers

Amy Lee, Taipei; Rodney Chan, DIGITIMES Asia 0

Taiwan makers of plastic ball-grid array (PBGA) and chip-scale package (CSP) substrates have reported a rebound in demand from network chipmakers such as Broadcom, Marvell, and Texas Instruments, who have managed to clear their excess inventories, according...

The article requires paid subscription. Subscribe Now