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Driver IC packaging and testing prices to rise 10-20%

Amy Lee, Hsinchu; Carrie Yu, DIGITIMES Asia Thursday 16 June 2005 0

Major Taiwan-based packaging and testing companies such as ChipMOS Technologies, International Semiconductor Technology (IST), Siliconware Precision Industries Ltd (SPIL) and Chipbond Technology plan to raise their prices for back-end driver IC packaging...

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