Ralink and ZyDAS to start marketing MIMO chips in early 2006

Kathryn Chiu, Taipei; Steve Shen, DIGITIMES Asia Friday 25 November 2005 0

Two Taiwan-based IC design houses, Ralink Technology and ZyDAS Technology, are expected to start marketing their respective MIMO (multi-in multi-out) Wi-Fi chips in early 2006, according to market sources.

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