Home Tech Semiconductors

UTAC to begin FC packaging in 1H 2006

Amy Lee, Singapore; Esther Lam, DIGITIMES Asia Thursday 1 December 2005 0

Singapore-based United Test and Assembly Center (UTAC) plans to offer flip chip (FC) packaging in volume in the first half of 2006, with the company having already landed orders. The company stated it expects to attain five FC packaging lines in 2006...

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Tomorrow's Headlines.
Asia Supply Chain 250 dataset access.