UTAC to begin FC packaging in 1H 2006

Amy Lee, Singapore; Esther Lam, DIGITIMES Asia Thursday 1 December 2005 0

Singapore-based United Test and Assembly Center (UTAC) plans to offer flip chip (FC) packaging in volume in the first half of 2006, with the company having already landed orders. The company stated it expects to attain five FC packaging lines in 2006...

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