Unimicron to ramp up FC substrate capacity by 15-18% in 3Q10

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia Thursday 29 April 2010 0

Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at the company's latest investors conference.

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