Home Tech Semiconductors

Nanya PCB to expand capacity for FC substrates and HDI boards

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 25 May 2010 0

Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand its HDI board capacity to meet growing demand for consumer electronics...

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Tomorrow's Headlines.
Asia Supply Chain 250 dataset access.