CoWoS, SiP to be key packaging processes for AI chips

Nobunaga Chai, DIGITIMES Research, Taipei

Jan 31, 2018, 15:25 0

High performance computing (HPC) will become the most crucial platform in the development of process technologies for AI (artificial intelligence) chips, and CoWoS (chip on wafer on substrate) and SiP (system in package) will emerge as key packaging processes...

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