中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
    1min ago
    Home Research Research insights

    Denso deepens deployments for third-gen semiconductors; Foxconn partners with Vedanta; XPeng expands presence in Europe

    Tom Lo, DIGITIMES Research, Taipei 0
    The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please sign in if you wish to continue.

    Introduction

    Related story
    Denso launches new RC-IGBT for EV, reducing energy loss by 20%
    Tags
    Asia enterprises automotive Denso Digitimes Research Europe Foxconn India Japan TSMC Vedanta
    Companies
    Research Report Database
    BIZ FOCUS
    May 9, 11:30
    Is your AI system built to last—or bound to fail? Only DEEPX has the answer
    Wednesday 14 May 2025
    Lynwave Technology: Pioneering integrated ATM solutions for future of wireless connectivity
    Wednesday 14 May 2025
    VIA Labs presents USB4 gaming dock reference design compliant with the latest EU EUP/ERP regulations
    Friday 9 May 2025
    Cutting power and costs: DEEPX outperforms even free chips in TCO