Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
At the 3D IC/CoWoS for AI forum during SEMICON Taiwan 2024, DJ Lee, COO of Taiwan-based IC substrate and PCB manufacturer Zhen Ding Technology, emphasized the critical role of IC substrates in advanced semiconductor manufacturing. This marks Zhen Ding Technology's debut at SEMICON Taiwan.
Lee highlighted that as 3D packaging technology evolves, IC substrates are becoming increasingly complex and vital to semiconductor processes. Zhen Ding provides a range of high-end IC substrates and operates one of the industry's most advanced and highly automated IC substrate manufacturing facilities.
Lee highlighted that IC substrates are expected to advance in four key areas: increased height, larger sizes, greater precision, and improved flatness. Substrate dimensions, which were about 75x60mm in 2020, are projected to grow to 150x150mm by 2026. Additionally, the number of layers is anticipated to increase from 20 in 2020 to 28, representing a growth of approximately 40%.
Lee also noted that Zhen Ding will increasingly focus on developments related to advanced packaging. By integrating resources from material suppliers, equipment manufacturers, system integrators, and academic institutions, Zhen Ding aims to drive growth in the substrate industry. The company strives to become one of the top five global IC substrate manufacturers by 2030.
Zhen Ding excels in high-layer and high-precision PCBs and plans to offer the industry's most advanced PCB products under the "cloud, pipe, and edge" concept for comprehensive AI applications. As electronic products become lighter, thinner, shorter, and smaller, PCB boards are also evolving, with many multilayer boards now exceeding 60 layers.
Recent progress on Zhen Ding's new factories has exceeded expectations. The Kaohsiung facility has begun trial production, while the Thailand plant broke ground in December 2023, and a topping-out ceremony was held in late August 2024.
In June 2023, Zhen Ding's subsidiary, Avary Singapore Private Limited, collaborated with Thailand's Saha Group to sign a memorandum of understanding (MoU) for the joint establishment of Peng Shen Technology. This partnership is set to establish a new production base in Thailand. Zhen Ding has committed approximately US$250 million for the project's first phase, with trial production anticipated in the first half of 2025 and mass production slated for the latter half of the year.
