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Innolux delays packaging milestone to 2025, pivots to automotive and PMIC sectors

Flora Wang, DIGITIMES, Taipei 0

Innolux chairman and CEO Jin-Yang Hung. Credit: DIGITIMES

Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, as shifting demand and complex verification processes impede progress. Chairman and CEO Jin-Yang Hung stressed the need for...

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