These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's aggressive R&D-driven resurgence, and growing momentum across Asia in AI semiconductors and advanced packaging. As global tech giants recalibrate in response to shifting supply chain dynamics, export controls, and rising open-source threats, the week's top stories reflect deepening fault lines—and fresh opportunities—across the semiconductor and system architecture landscape.
Arm retires Cortex brand, teases proprietary chip as RISC-V heat rises
Arm Holdings is phasing out its Cortex brand and launching five new CPU lines—Neoverse, Niva, Lumex, Zena, and Orbis—built on its CSS architecture. The rebrand comes as fourth-quarter revenue tops US$1 billion, with full-year revenue projected to exceed US$4 billion. Arm is also moving into chip design for the first time, with TSMC producing the chips and Meta reportedly among early customers. The shift has drawn criticism from Qualcomm and comes amid rising pressure from RISC-V, led by the Quintauris consortium, and ongoing risks tied to Arm's 17% revenue exposure to China.
Wolfspeed faces uncertainty as CHIPS delay, China competition undercut SiC lead
Wolfspeed has denied bankruptcy rumors but is under pressure as a US$750 million CHIPS Act grant remains delayed. Despite leading in 8-inch SiC wafers, the company is losing ground to cheaper Chinese rivals and slowing EV demand.
While Trump's previous export controls gave Wolfspeed strategic leverage, China's growing SiC capacity has weakened that edge. A bailout now seems less likely, but with Trump back in office, Washington will unlikely let core US chip technology fall into foreign hands. With no clear buyers and high domestic costs, Wolfspeed's options remain limited.
China's UniVista launches full-stack EDA suite to upend US dominance
China's UniVista Industrial Software Group is offering free trials of its full-stack EDA suite as US restrictions threaten access to Synopsys, Cadence, and Siemens tools. Founded by ex-Synopsys and Cadence executives, the firm has launched UniVista Archer—China's first high-end, IP-owned PCB design platform for AI, 5G, and automotive chips.
The company now serves 200+ IC design firms, has 1,100 staff (85% technical), and is working with Empyrean Technology to advance China's EDA independence—an effort reportedly backed by Huawei.
TSMC cautious on High NA as ASML unveils its US$400M chipmaking machine
TSMC is holding off on adopting ASML's US$400 million High NA EUV tool, with Deputy Co-COO Kevin Zhang confirming it won't be used in upcoming A14 or A16 nodes. Intel has already installed two systems, and Samsung Electronics has committed, but TSMC aims to extend current EUV capabilities first. ASML, meanwhile, has shipped five High NA units and plans five more in 2025. It's also building a training center in Arizona and preparing its next leap—Hyper NA EUV—by the early 2030s.
Huawei defies US sanctions with record revenue and R&D transformation
Huawei posted 2024 revenue of CNY862.1 billion (US$120 billion), its second-highest ever, despite a 28% drop in net profit to CNY62.6 billion due to a sharp rise in R&D spending (CNY179.7 billion, or 20% of revenue). The company shipped nearly 46 million smartphones in 2024, reclaiming second place in China thanks to HarmonyOS. While overseas growth remains limited, Huawei is expanding in wearables and connected devices as part of a broader push for tech self-reliance.
Samsung Electro-Mechanics targets AI packaging with glass substrates to compete with TSMC
Samsung Electro-Mechanics will begin glass substrate sample production in Sejong, South Korea, by mid-2025, aiming to supply two to three major US tech firms. The move targets AI and HPC packaging demands and is part of a broader collaboration with Samsung to build a local glass interposer supply chain. With better heat resistance and circuit density, glass substrates offer up to 40% faster chip speeds at half the power, positioning Korean firms to challenge TSMC in advanced packaging.
India's AI chip startups gain ground with TI, Intel, AMD veteran talent, government support
Former executives from Intel, AMD, and TI are launching AI chip startups in India, led by Bengaluru-based C2i Semiconductors, which raised US$4 million and secured support from India's DLI scheme. Bodhi Computing, now part of Bhavish Aggarwal's Krutrim, plans to release Bodhi 1 in 2026 and Bodhi 2 by 2028.
With funding for Indian chip startups rising from US$5 million in 2023 to over US$28 million in 2024, and government programs aiming to train 85,000 chip professionals, India is stepping up its "Design in India" ambition.
Article edited by Jerry Chen
