Rapidus, Japan's leading semiconductor company, unveiled its first set of 2nm prototype chips on July 18 during a press event held in Chitose City, Hokkaido. The unveiling took place at a hotel near the company's pilot production site and drew a crowd of about 200 suppliers and prospective clients.
CEO Atsuyoshi Koike announced that the chips had passed initial functionality tests on July 10, describing the achievement as a significant milestone. He showcased a 30cm wafer featuring gold-toned gate-all-around (GAA) transistors, noting that the devices, manufactured through a trial production line initiated in April, had achieved performance levels that could meet customer expectations.
Accelerated fab construction and technical progress
Chairman Tetsuro Higashi applauded the blistering pace of Rapidus's fab construction, calling it a rare feat that has stunned observers across the global chip industry. One external board member admitted there were initial doubts about the viability of producing 2nm chips but said those concerns have eased as the project remains largely on track.
The prototype wafers unveiled this week represent a mid-stage integration of core functionalities. Rapidus aims to continue fine-tuning transistor performance and boosting production yields throughout the rest of 2025. If the chips can deliver on their promises of high computing power and energy efficiency, that progress could be the tipping point in securing commitments from key customers.
Toward a commercial offering
In a bid to faithfully reproduce IBM's 2nm process technology, Rapidus has instituted 24-hour shifts, allowing engineers to continuously optimize equipment settings and process conditions. The company also plans to release updated process design kits (PDKs) to prospective clients during the 2025 fiscal year, spanning April 2025 to March 2026, giving customers the tools to conduct in-depth technical evaluations.
Addressing concerns over client acquisition, CEO Atsuyoshi Koike said he expects the company's customer pipeline to "come into clearer focus" by the end of the year.
Market research company Omdia has estimated that Rapidus currently produces approximately 7,000 12-inch wafers per month. The firm's production capacity is expected to increase significantly to between 25,000 and 30,000 wafers monthly as it prepares to commence mass production, scheduled for 2027.
(From left) Rapidus chairman Tetsuro Higashi, CEO Atsuyoshi Koike, Hokkaido Governor Naomichi Suzuki, and Mayor Ryuichi Yokota of Chitose.
Photo: Rapidus
Article edited by Joseph Tsai
