Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...

Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...

At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...

Upon TSMC Arizona's signing of a Preliminary Memorandum of Terms (PMT) with the Biden Administration, the decision to manufacture 2nm chips in its third fab and part of the second...

Intel's Fab 52 in Arizona is likely to miss its original target of starting commercial production by the end of 2024, and its prospective rollout of 2nm chips at the plant might not...

The three major players in advanced chip manufacturing have secured CHIPS Act subsidies by promising to increase investments in fabrication facilities within the United States. With...

As the US announces a US$6.4 billion subsidy for Samsung Electronics, Samsung has also officially announced additional investment plans in the US, aiming to promote the mass production...

Rapidus might have been caught off guard by TSMC's and Samsung's latest announcements of plans to make 2nm chips in the US, which threatens to undermine the Japanese chipmaker's competitiveness...

These are the most-read DIGITIMES Asia stories in the week of April 8 - April 12.

TSMC is making progress toward entering the A14 and 2nm process generations as planned, according to sources at fab toolmakers.

According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...

TSMC has revised its new fab project in Kaohsiung, southern Taiwan, by adding two more phases of expansion for 1.4nm (A14) process manufacturing, according to sources at fab tool...

Japan-based semiconductor material provider Dai Nippon Printing (DNP) will supply Rapidus with the photomasks for 2nm chips after mass production, scheduled for 2027.

The Leading-edge Semiconductor Technology Center (LSTC) established by the Japanese government, along with Rapidus, was formed in 2022, marking a crucial initiative for Japan's advancement...

Marvell Technology recently announced an expansion of its collaboration with TSMC to develop the industry's first 2nm silicon intellectual property (IP) technology platform designed...