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NEWS TAGGED 300MM
Tuesday 6 October 2009
Suss MicroTec teams up with ITRI for development in 3D integration
Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...
Tuesday 6 October 2009
TI opens 300mm analog fab in US
Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...
Wednesday 2 September 2009
Spansion says partnership with SMIC remains unchanged
Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's...
Friday 24 July 2009
UMC gearing up for 40nm
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Thursday 16 July 2009
Winbond remains cautious about expansion
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
Tuesday 14 July 2009
Globalfoundries calls for renewed focus on 300mm
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Wednesday 8 July 2009
Winbond completes transition to 300mm fab production
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Wednesday 24 June 2009
Intel to produce on 65nm in China
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Wednesday 10 June 2009
Chip equipment market to begin recovery by October, says The Information Network
The semiconductor equipment market will begin its recovery by October 2009, according to The Information Network.
Monday 8 June 2009
Intel on track to commence operations at China fab in 2010
Intel is scheduled to kick off operation at its 300mm fab in Dalian, China, in 2010, according to the company. The chip giant also said it is looking to integrate its assembly and...
Monday 18 May 2009
TSMC sees delay in e-beam equipment delivery
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...
Tuesday 21 April 2009
Semiconductor equipment makers wary of 450mm development, says The Information Network
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
Wednesday 18 March 2009
FlipChip announces 300mm strategic partnership with SMIC
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
Thursday 19 February 2009
NAND flash market prepares for rush orders
The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research