CONNECT WITH US
NEWS TAGGED 300MM
Friday 8 June 2012
Samsung to build new 12-inch fab for logic ICs
Samsung Electronics has unveiled plans to build a new fabrication line in Hwaseong, South Korea, to meet the growing demand for logic products.
Thursday 17 November 2011
STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
Tuesday 19 April 2011
STATS ChipPAC expands TSV offering
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
Monday 7 March 2011
Only 10 participants in 300mm wafer capacity space, says IC Insights
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...
Thursday 3 March 2011
Record capex leads to 28% fab equipment growth in 2011, says SEMI
SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...
Monday 21 February 2011
Intel announces new chip plant in Arizona
Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...
Wednesday 26 January 2011
Tight capacity forces semiconductor production efficiencies in 2010, says Semico
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
Wednesday 15 September 2010
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Tuesday 27 April 2010
Silicon demand set to rebound robustly in 2010, says iSuppli
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
Tuesday 13 April 2010
STATS ChipPAC intros 300mm embedded WLB wafer manufacturing
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
Wednesday 3 March 2010
BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
Friday 22 January 2010
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Friday 6 November 2009
Elpida and ProMOS ink partnership on DRAM
Elpida Memory and ProMOS Technologies announced on November 6 the signing of a DRAM foundry agreement.
Friday 9 October 2009
UMC ramping 45/40nm at Fab 12i
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
Tuesday 6 October 2009
Suss MicroTec teams up with ITRI for development in 3D integration
Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...
Next-Gen Retail Revolution: The Power of Edge AI and Cloud Surveillance
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research