Intel is scheduled to kick off operation at its 300mm fab in Dalian, China, in 2010, according to the company. The chip giant also said it is looking to integrate its assembly and...
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography for...
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...
