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NEWS TAGGED CCI
Thursday 29 August 2019
Cooling solutions providers to expand capacities on 5G smartphone demand
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Monday 15 July 2019
Taiwan cooling solution providers poised for robust growth
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
Thursday 11 July 2019
Vapor chamber to account for 50% of smartphone cooling module shipments in 2H19
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Thursday 27 June 2019
Rising public cloud demand triggering business model changes
With the public cloud continuing expanding its presence in the cloud computing market, a few players including HPE and Chaun-Choung Technology (CCI) have been pushing new products...
Tuesday 25 June 2019
Chaun-Choung poised to enter EV heatsink segment
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is poised to tap into the segment of heatsink solutions for electric vehicles and self-driving cars through Japan's...
Tuesday 26 February 2019
Cooling specialist Auras reportedly enters Samsung, Huawei supply chains
Taiwan-based Auras Technology has Korea and China smartphone vendors among its clients for cooling modules and will move to expand production of heat spreaders seen to be increasingly...
Tuesday 2 October 2018
Nidec to invest in cooling module firm CCI
Cooling module maker Chaun-Choung Technology (CCI) has disclosed that Japan-based Nidec is planning to acquire up to a 48% stake in the company through a tender offer at NT$108 (US$3.50)...
Wednesday 19 September 2018
Cooling module firms see server demand accelerate
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Friday 14 September 2018
Smartphone vendors looking for new thermal management solutions for 5G phones
While preparing to launch 5G-enabled smartphones in the first half of 2019, most major handset vendors are reportedly seeking new thermal management solutions in response to heat...
Tuesday 4 July 2017
CCI expects rising demand in 2H17, says paper
Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...
Wednesday 9 November 2016
CCI revenues rise, but profits drop in 3Q16
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) has announced third-quarter consolidated revenues of NT$1.86 billion (US$58.86 million), up 3.04% sequentially, but...
Wednesday 16 March 2016
Chaun-Choung attains over 90% yield rates for all product lines
Heat-sink pipe and thermal module maker Chaun-Choung Technology has increased yield rates for all product lines to more than 90% by using automation equipment, the company said at...
Friday 31 July 2015
Notebook component makers shift to server applications along with ODMs
While notebook ODMs, such as Quanta Computer and Compal Electronics, have been expanding staff specifically for servers used in cloud computing data centers, their component suppliers,...
Tuesday 26 August 2014
Component makers take measures to prevent gross margins from dropping
With notebook vendors becoming more aggressive in releasing low-price notebooks and leaning toward adopting cheaper components for these devices, components makers have started taking...
Monday 21 April 2014
Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research