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Friday 31 July 2015
Notebook component makers shift to server applications along with ODMs
While notebook ODMs, such as Quanta Computer and Compal Electronics, have been expanding staff specifically for servers used in cloud computing data centers, their component suppliers,...
Tuesday 26 August 2014
Component makers take measures to prevent gross margins from dropping
With notebook vendors becoming more aggressive in releasing low-price notebooks and leaning toward adopting cheaper components for these devices, components makers have started taking...
Monday 21 April 2014
Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
Thursday 12 December 2013
CCI steps into marketing non-notebook heat-sink devices
Chaun-Choung Technology (CCI) has extended development and production from heat-dissipation pipes and thermal modules for use in notebooks to those for use in servers, smartphones,...
Monday 17 June 2013
First-tier players may release smartphones that adopt heat pipes by the end of the year
Smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected...
Monday 28 January 2013
CCI sees strong vapor chamber shipments in 2012
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is estimated to have shipped about five million vapor chambers in 2012, up significantly from about two million units...
Monday 21 January 2013
Cooling module makers to benefit from smartphone and tablet orders in 2013
Cooling module makers, which used to mainly focus on supplying notebook products, are expected to benefit from orders from smartphone and tablet products in the second quarter of...
Thursday 3 January 2013
Demand for thermal modules used in convertible notebooks increasing
As Windows 8 has stimulated increasing demand for convertible notebooks, orders for related thermal modules are expected to be on the rise, according to Taiwan-based thermal module...
Tuesday 15 February 2011
High copper price damaging profitability of notebook component makers
Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...
Wednesday 15 December 2010
Auras, Chaun Choung hope to reflect impact of currency exchange on pricing for notebook thermal modules
Auras Technology and Chaun Choung Technology, two Taiwan-based makers of thermal modules, are developing new models for use in notebooks to be launched in the first quarter of 2011...
Friday 17 September 2010
Chaun Choung looks to ship 40 million notebook cooler modules in 2010
Notebook cooler module maker Chaun Choung Technology expects its cooler module shipments to top 40 million units in 2010, accounting for a 20% of the global cooler module market,...
Monday 14 June 2010
Notebook cooling module makers report mix results for May
Taiwan-based notebook cooling module maker Chaun-Choung Technology (CCI) saw its consolidated revenues in May 2010 increase 2.3% sequentially, while Auras Technology and Forcecon...
Thursday 15 April 2010
Notebook cooling module makers expect higher gross margins in 2Q10
Taiwan-based notebook cooling module makers Chaun-Choung Technology (CCI) and Auras Technology expect their gross margins in the second quarter of 2010 to be higher than in the first...
Friday 26 March 2010
All-in-one PCs could be boon for cooling module makers
Major Taiwan-based PC cooling modules makers, Chaun-Choung Technology (CCI) and Auras Technology, expect the booming global sales of all-in-one PCs will boost their performance as...
Thursday 25 March 2010
Cooling module makers to expand capacity in 2010
Taiwan-based cooling module makers Chaun-Choung Technology (CCI) and Auras Technology both plan to increase their heatpipe capacity in 2010 to fulfill their orders.