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NEWS TAGGED CHIPMOS
Tuesday 3 September 2013
ChipMOS and Thailin land backend orders for fingerprint sensors, says report
Packaging and testing company ChipMOS Technologies and its subsidiary Thailin Semiconductor, which provides testing services for memory ICs, logic ICs and mixed-signal ICs, have teamed...
Monday 24 June 2013
ChipMOS to expand capacity for LCD driver ICs, says chairman
Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall...
Tuesday 21 May 2013
Demand for large-size driver ICs to boom in 2H13, say backend firms
Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...
Monday 20 May 2013
ChipMOS capex for 2013 to reach NT$2.5-2.8 billion
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...
Monday 22 April 2013
ChipMOS subsidiary begins trading on Taiwan emerging stock board
ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies, on April 19 started trading on the Emerging Stock Board of the Taiwan Stock...
Thursday 18 April 2013
ChipMOS sees orders for NAND flash, driver ICs pick up
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...
Tuesday 16 April 2013
ChipMOS subsidiary approved for listing on Taiwan stock market
The Taiwan Stock Exchange (TSE) has approved the listing application of ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies.
Thursday 7 March 2013
Himax reportedly lands LCoS solution orders for Google Glass
Himax Technologies reportedly has landed orders for LCoS (liquid crystal on silicon) solutions from Google for its Google Glass devices, and shipments of LCoS solutions are expected...
Tuesday 22 January 2013
Chipbond, ChipMOS 2013 capex to stay flat
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.
Monday 24 December 2012
ChipMOS to focus 2013 capex on LCD driver IC testing capacity
Taiwan-based IC packaging/testing service provider ChipMOS Technologies plans to set aside NT$2.2-2.5 billion (US$75.5-85.8 million) for its 2013 capex budget and use 50% of the amount...
Tuesday 21 August 2012
ChipMOS announces new share buyback program
ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...
Monday 20 August 2012
ChipMOS expects 4-8% growth in 3Q12 sales
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects to post sales growth of 4-8% sequentially in the third quarter of...
Friday 6 July 2012
Thailin 2Q12 sales up 18%
Orders from Japan-based AKM Semiconductor have boosted sales at Thailin Semiconductor, which saw a 17.7% sequential increase in the second quarter of 2012.
Wednesday 4 July 2012
Most backend firms give positive 3Q12 outlook
With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
Tuesday 26 June 2012
Spansion, ChipMOS extend partnership
Packaging and testing firm ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan and Spansion have extended their ongoing agreement through April 2014.
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