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Thursday 8 September 2011
SEMICON Taiwan 2011: Companies announce job openings
A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...
Monday 22 August 2011
More firms reducing exposure in DRAM packaging and testing market
The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...
Friday 19 August 2011
ChipMOS expects weak 3Q11
LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...
Tuesday 26 July 2011
Chipbond, ChipMOS expect flat revenues in 3Q11
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...
Friday 15 July 2011
ChipMOS mulls phasing out DRAM backend business
Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...
Thursday 14 July 2011
ChipMOS secures NT$8.4 billion syndicated loan
IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...
Monday 25 April 2011
IC testing firm Thailin to control packaging house ChipMOS Shanghai
IC testing house Thailin Semiconductor will spend US$39.95 million to take up the control of ChipMOS Technologies (Shanghai) through the purchase of Modern Mind Technology, which...
Tuesday 19 April 2011
ChipMOS reports growth in 1Q11 revenues
IC packaging and testing firm ChipMOS Technologies (Bermuda) has reported NT$1.57 billion (US$53.3 million) in March 2011 revenues, up 15.7% sequentially and 20.9% on year. Revenues...
Thursday 24 February 2011
ChipMOS to sell idle, non-core assets for US$11.6 million
Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...
Wednesday 17 November 2010
ChipMOS posts profitable 3Q10
IC packaging house ChipMOS Technologies has reported NT$4.717 billion (US$155.908 million) in revenues for the third quarter of 2010, up 4.9% sequentially on sales of Mask ROM and...
Friday 12 November 2010
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
Tuesday 5 October 2010
ChipMOS to expand into 12-inch gold bumping
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Tuesday 5 October 2010
ChipMOS to collect another US$68 million through selling Spansion debt
ChipMOS Technologies has revealed it will receive a total of US$68 million in cash this week, through selling its unproductive accounts receivable from Spansion to Citigroup. The...
Friday 20 August 2010
ChipMOS posts profits in two consecutive quarters
ChipMOS Technologies has reported net profits of NT$207.5 million (US$6.5 million) for the second quarter of 2010, the second straight quarter in which the company gained profits...
Wednesday 19 May 2010
ChipMOS swings to profits in 1Q10; expects on-quarter revenue growth in 2Q
ChipMOS Technologies has reported consolidated net profits of NT$271.2 million (US$8.6 million) on a US GAAP basis for the first quarter of 2010, following net losses over the past...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
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